Novel Ruggedized Packaging Technology for VCSELs

We describe chip-scale packaging (CSP) technology for compact, low-cost optical transceivers that contain OTDR technology. CSP creates board-level solder interconnect at the wafer level, eliminating the cost and parasitics associated with packages. OTDR technology enables insitu monitoring of fiber...

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Bibliographic Details
Main Author: Kuznia,Charlie
Format: Report
Language:English
Online Access:Request full text
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Summary:We describe chip-scale packaging (CSP) technology for compact, low-cost optical transceivers that contain OTDR technology. CSP creates board-level solder interconnect at the wafer level, eliminating the cost and parasitics associated with packages. OTDR technology enables insitu monitoring of fiber links. 42nd Annual Gomactech Conference (gomactech 17), 20 Mar 2017, 23 Mar 2017, See also AD1034309 - 42nd Annual Gomactech Conference (GOMACTech 17) Government Microcircuit Applications And Critical Technology Conference. Technologies For Secure Spectrum Access From Dc To Light. Held At The Grand Sierra Resort, Reno, Nevada, March 20-23, 2017.