Liquid Cooled Variable Speed Constant Frequency (VSCF) Converter Device Development

Further miniaturization of high-power semi-conductor devices utilizing silicon disks larger than 12 mm. requires major innovations to improve the average thermal impedance and surge capability. The high thermal impedance in existing discrete devices is caused mostly by the dry interfaces necessary t...

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Bibliographic Details
Main Author: Butler,John W
Format: Report
Language:English
Subjects:
Beryllium oxides
Bonded joints
Copper
Disks
Drying
Electric generators
Electrical and Electronic Equipment
Frequency converters
High power
Liquid cooling
Miniaturization
PE62203F
Polyimide resins
Semiconductor devices
Silicon
Solid State Physics
Thermal conductivity
Variable speed drives
VSCF(Variable Speed Constant Frequency)
WUAFWAL31452955
WUAFWAL31452958
Online Access:Request full text
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Summary:Further miniaturization of high-power semi-conductor devices utilizing silicon disks larger than 12 mm. requires major innovations to improve the average thermal impedance and surge capability. The high thermal impedance in existing discrete devices is caused mostly by the dry interfaces necessary to provide stress relief. This report presents a unique approach to solving the dry interface problem. It describes the design, fabrication and evaluation of a smaller, lighter, electrically isolated dual thyristor module featuring structured copper, solder bonding, polyimide passivation, direct bonded copper on beryllium oxide and a hermetic sealed aluminum case. Details of the SCR modules evaluation in a 60 KVA single channel VSCF electrical generating system are included. (Author)