Electronic Components for High-g Hardened Packaging

A survey of packaging technology applicable to high-g environments is presented. Specifics of the artillery gun launch environment are discussed. The advantages and disadvantages of various external techniques including underfill and potting are also discussed. Discussion of the impact of the manufa...

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Bibliographic Details
Main Author: Berman, Morris S
Format: Report
Language:English
Subjects:
ACCELERATION
Ammunition and Explosives
ARTILLERY
Containers and Packaging
ELECTRONIC EQUIPMENT
EXCITATION
GUN LAUNCHED
HIGH ACCELERATION
HIGH FREQUENCY
PACKAGING
PE62105A
PROJECTILES
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Description
Summary:A survey of packaging technology applicable to high-g environments is presented. Specifics of the artillery gun launch environment are discussed. The advantages and disadvantages of various external techniques including underfill and potting are also discussed. Discussion of the impact of the manufacturing process and resulting defects is included. Some key failure mechanisms are also identified. The original document contains color images.