Improved Electrical Properties of Epoxy Resin With Nanometer-Sized Inorganic Fillers (Postprint)

Nanometer-sized inorganic fillers are increasingly used as reinforcing materials for mechanical or thermal property improvement of polymers. Improvements in mechanical modulus or heat deflection temperature are often realized. These fillers may also improve some electrical properties such as corona...

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Bibliographic Details
Main Authors: Horwath, John C, Schweickart, Daniel L, Garcia, Guido, Klosterman, Donald, Galaska, Mary, Schrand, Amanda, Walko, Lawrence C
Format: Report
Language:English
Subjects:
BREAKDOWN VOLTAGE
BREAKDOWN(ELECTRONIC THRESHOLD)
DIELECTRIC PROPERTIES
ELECTRICAL CORONA
Electricity and Magnetism
EPOXY RESINS
FILLERS
Inorganic Chemistry
INORGANIC FILLERS
INORGANIC MATERIALS
NANOSTRUCTURES
PE62203F
Plastics
POSS(POLYHEDRAL OLIGOMERIC SILSESQUIOXANE)
SYMPOSIA
WUAFRL314532Z7
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Summary:Nanometer-sized inorganic fillers are increasingly used as reinforcing materials for mechanical or thermal property improvement of polymers. Improvements in mechanical modulus or heat deflection temperature are often realized. These fillers may also improve some electrical properties such as corona endurance or dielectric breakdown voltage in polymers. In compact high voltage power supplies, epoxy resins are often the potting material of choice in manufacturing processes. This is often true for applications requiring a robust or position-insensitive insulation system design, such as mobile communications equipment or aerospace flight vehicles. Nanometer-sized inorganic fillers in epoxy resins can result in improved mechanical and electrical performance, without affecting the processes for component manufacturing. In our previous work, polyhedral oligomeric silsesquioxane (POSS) was selected as the nanometer-sized inorganic filler of interest. POSS-filled epoxies showed a five times improvement in ac corona lifetime for selected POSS-epoxy blends compared to unloaded epoxy. Presented at the IEEE International Power Modulator Conference held in Washington, DC on 14-18 May 2006. Published in the Proceedings of the IEEE International Power Modulator Conference, p189-191, 2006.