Power Mems Development

This month in Task 1.1 we made changes to two masks (Metal 3 and Dielectric) to improve the performance of the circuit breaker. Both double-side-polished (DSP) and silicon-on-insulator (SOI) wafers were processed using the revised masks. The original document contains color images.

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Bibliographic Details
Main Authors: Hanser, Andrew, Bumgarner, John
Format: Report
Language:English
Subjects:
CIRCUIT BREAKERS
DIELECTRICS
Electrical and Electronic Equipment
PERFORMANCE(ENGINEERING)
WAFERS
Online Access:Request full text
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Description
Summary:This month in Task 1.1 we made changes to two masks (Metal 3 and Dielectric) to improve the performance of the circuit breaker. Both double-side-polished (DSP) and silicon-on-insulator (SOI) wafers were processed using the revised masks. The original document contains color images.