Multiphysics simulation of microwave curing in micro-electronics packaging applications

• Published in: Soldering & surface mount technology 2007-01, Vol.19 (3), p.26-33
• Main Authors: Tilford, T, Sinclair, K.I, Bailey, C, Desmulliez, M.P.Y, Goussettis, G, Parrott, A.K, Sangster, A.J
• Format: Article
• Language: English
• Subjects: Algorithms; Applied sciences; Curing; Design. Technologies. Operation analysis. Testing; Dielectric properties; Electric fields; Electrical engineering; Electronics; Energy; Exact sciences and technology; Finite volume method; Fourier transforms; Heat; Integrated circuits; Materials; Microelectronics; Microwave heating; Microwaves; Ovens & stoves; Packaging; Partial differential equations; Polymers; Productivity; Resins; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Simulation; Studies; Temperature
• ISSN: 0954-0911; 1758-6836
• DOI: 10.1108/09540910710843757

Purpose - This paper aims to present an open-ended microwave curing system for microelectronics components and a numerical analysis framework for virtual testing and prototyping of the system, enabling design of physical prototypes to be optimized, expediting the development process.Design methodology approach - An open-ended microwave oven system able to enhance the cure process for thermosetting polymer materials utilised in microelectronics applications is presented. The system is designed to be mounted on a precision placement machine enabling curing of individual components on a circuit board. The design of the system allows the heating pattern and heating rate to be carefully controlled optimising cure rate and cure quality. A multi-physics analysis approach has been adopted to form a numerical model capable of capturing the complex coupling that exists between physical processes. Electromagnetic analysis has been performed using a Yee finite-difference time-domain scheme, while an unstructured finite volume method has been utilized to perform thermophysical analysis. The two solvers are coupled using a sampling-based cross-mapping algorithm.Findings - The numerical results obtained demonstrate that the numerical model is able to obtain solutions for distribution of temperature, rate of cure, degree of cure and thermally induced stresses within an idealised polymer load heated by the proposed microwave system.Research limitations implications - The work is limited by the absence of experimentally derived material property data and comparative experimental results. However, the model demonstrates that the proposed microwave system would seem to be a feasible method of expediting the cure rate of polymer materials.Originality value - The findings of this paper will help to provide an understanding of the behaviour of thermosetting polymer materials during microwave cure processing.