Non-destructive detection methods for discontinuities of interconnection structures

• Published in: Microelectronics international 2016-01, Vol.33 (1), p.23-35
• Main Author: Blecha, Tomas
• Format: Article
• Language: English
• Subjects: Boards; Cracks; Discontinuity; Electrical & electronic engineering; Electronics; Electronics industry; Engineering; Interconnection; Localization; Microelectronics; Nondestructive testing; Position (location); Printed circuit boards; Screen printing
• ISSN: 1356-5362; 1758-812X
• DOI: 10.1108/MI-09-2014-0040

Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices.