Impact of convection on thermographic analysis of silver based thermal joints

Purpose This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer effici...

Full description

Saved in:
Bibliographic Details
Published in:Soldering & surface mount technology 2020-08, Vol.32 (4), p.241-246
Main Authors: Stojek, Krzysztof Jakub, Felba, Jan, Nicolics, Johann, Wołczyński, Dominik
Format: Article
Language:English
Subjects:
Accuracy
Cameras
Energy dissipation
Epoxy resins
Heat conductivity
Heat transfer
Impact analysis
Impact resistance
Infrared analysis
Infrared windows
Metallizing
Radiation
Receivers & amplifiers
Silicon
Silver
Sintering
Temperature
Thermal analysis
Thermal conductivity
Thermal energy
Thermal resistance
Thermodynamic properties
Thermography
Vacuum chambers
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Purpose This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy. Design/methodology/approach Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred. Findings The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss. Originality/value It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.
ISSN:0954-0911
1758-6836
DOI:10.1108/SSMT-11-2019-0040