Size dependence of the activation energy of diffusion in multilayer Cu-Ni films

The results of studying the effect of the characteristic size on the rate of diffusion processes in nanometer Cu-Ni film systems have been reported. The film system has been prepared by sequential vacuum deposition of the components, and the activation energy of diffusion has been determined from a...

Full description

Saved in:
Bibliographic Details
Published in:Physics of the solid state 2014-04, Vol.56 (4), p.823-826
Main Authors: Minenkov, A. A., Bogatyrenko, S. I., Sukhov, R. V., Kryshtal, A. P.
Format: Article
Language:English
Subjects:
Activation energy
Electric properties
Physics
Physics and Astronomy
Solid State Physics
Surface Physics and Thin Films
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The results of studying the effect of the characteristic size on the rate of diffusion processes in nanometer Cu-Ni film systems have been reported. The film system has been prepared by sequential vacuum deposition of the components, and the activation energy of diffusion has been determined from a change in the electrical resistance of the film system in a heating-cooling cycle. It has been shown that the activation energy of grain-boundary diffusion decreases with decreasing characteristic size of the system and amounts to 0.25 eV for the film system with a characteristic size of 5 nm, which corresponds to an increase in the grain-boundary diffusion coefficient by 10 orders of magnitude with respect to massive samples.
ISSN:1063-7834
1090-6460
DOI:10.1134/S1063783414040210