Ultra-low thermal conductivity in W/[Al.sub.2][O.sub.3] nanolaminates

Atomic layer deposition and magnetron sputter deposition were used to synthesize thin-film multilayers of W/[Al.sub.2][O.sub.3]. With individual, layers only a few nanometers thick, the high interface density produced a strong impediment to heat transfer, giving rise to a thermal conductivity of ~0....

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Bibliographic Details
Published in:Science (American Association for the Advancement of Science) 2004-02, Vol.303 (5660), p.989
Main Authors: Costescu, R.M, Cahill, D.G, Fabreguette, F. H, Sechrist, Z. A, George, S.M
Format: Article
Language:English
Subjects:
Design and construction
Dielectric films
Insulating materials
Insulation (Heat)
Properties
Thermal insulation
Thin films
Online Access:Get full text
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Summary:Atomic layer deposition and magnetron sputter deposition were used to synthesize thin-film multilayers of W/[Al.sub.2][O.sub.3]. With individual, layers only a few nanometers thick, the high interface density produced a strong impediment to heat transfer, giving rise to a thermal conductivity of ~0.6 watts per meter per kelvin. This result suggests that high densities of interfaces between dissimilar materials may provide a route for the production of thermal barriers with ultra-low thermal conductivity.
ISSN:0036-8075
1095-9203