Copper via fill--solution for HDI via-in-pad: via fill for via-in-pad designs improves manufacturability from board fab through assembly

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Bibliographic Details
Published in:Printed circuit design & manufacture 2007-10, Vol.24 (10), p.24
Main Authors: Shea, Chrys, Ormerod, David
Format: Article
Language:English
Subjects:
Plant growth inhibiting substances
Online Access:Get full text
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ISSN:1543-6527