Low-loss fluoropolymer copper clad laminate: improved evaluation methods clarify dielectric loss, including conductor loss and roughness loss on copper-clad laminate materials

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Bibliographic Details
Published in:Printed circuit design & manufacture 2008-08, Vol.25 (8), p.31
Main Authors: Niwano, Kazuhiko, Reyes, Manuel, Ono, Mitsufumi, Ikawa, Koji
Format: Article
Language:English
Subjects:
Fluorine compounds
Laminated materials
Methods
Polymers
Online Access:Get full text
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ISSN:1543-6527