Development and adhesion characterization of a silicon wafer for temporary bonding

The development of a silicon temporary carrier for thin wafer handling for 3D applications was investigated. Process selection and optimization ended up with a silicon carrier entirely covered with an antistick layer based on a fluorinated polymer. The carrier preparation was quite easy because only...

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Bibliographic Details
Published in:International journal of adhesion and adhesives 2018-04, Vol.82, p.100-107
Main Authors: Montméat, P., Enot, T., Enyedi, G., Pellat, M., Thooris, J., Fournel, F.
Format: Article
Language:English
Subjects:
Adhesion
Adhesive bonding
Chemical cleaning
Engineering Sciences
Fluorination
Hydrophobic surfaces
Mechanical polishing
Organic chemistry
Polymers
Process selection
Silicon
Silicon devices
Silicon oxides
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Summary:The development of a silicon temporary carrier for thin wafer handling for 3D applications was investigated. Process selection and optimization ended up with a silicon carrier entirely covered with an antistick layer based on a fluorinated polymer. The carrier preparation was quite easy because only one coating was used and no sticking edge zone was needed onto the carrier. The fluorinated coating led to a very hydrophobic behavior. When bonded with a thermoplastic glue, it also exhibited very antiadhesive properties because the adherence was as low as 0.4J/m2 and lower than the adherence of a stack without any antiadhesive layer (above 4J/m2). The carrier was nevertheless suitable for different back side processes in 300mm: grinding, chemical cleaning, chemical mechanical polishing and silicon oxide deposition. Compared with a commercial carrier, it exhibited the same level of performance for the integration. The proposed carrier was compatible with a mechanical debonding of a thinned bonded structure with a silicon device wafer of 80µm. The carrier recycling was possible without any new preparation.
ISSN:0143-7496
1879-0127
DOI:10.1016/j.ijadhadh.2018.01.007