Evaluation of a micropackaging analysis technique by highfrequency microwaves

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Bibliographic Details
Published in:Microelectronics and reliability 2002, Vol.42 (9), p.1551-1554
Main Authors: Duchamp, G., Ousten, Y., Danto, Y.
Format: Article
Language:English
Subjects:
Engineering Sciences
Micro and nanotechnologies
Microelectronics
Online Access:Get full text
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ISSN:0026-2714
1872-941X
DOI:10.1016/S0026-2714(02)00188-9