Resist trimming etch process control using dynamic scatterometry

Dynamic scatterometry is an optical metrology technique designed for the in situ real time process control in the production of microelectronic devices. This technique has many advantages; however, the main limitation in the real time context comes from the short data acquisition time for the needed...

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Bibliographic Details
Published in:Microelectronic engineering 2009-04, Vol.86 (4), p.1040-1042
Main Authors: El kodadi, M., Soulan, S., Besacier, M., Schiavone, P.
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Ellipsometry
Engineering Sciences
Exact sciences and technology
In situ metrology
Micro and nanotechnologies
Microelectronic fabrication (materials and surfaces technology)
Microelectronics
Real time
Resist trimming
Scatterometry
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Summary:Dynamic scatterometry is an optical metrology technique designed for the in situ real time process control in the production of microelectronic devices. This technique has many advantages; however, the main limitation in the real time context comes from the short data acquisition time for the needed wavelength range. We present here the different tools we developed to perform dynamic scatterometry, such as specific software and hardware tools. We show how these tools can successfully be used to monitor the resist etch process in an industrial chamber from Applied Materials equipped with an in situ ellipsometer. Results from determining CD and thickness shows excellent agreement between the scatterometry measurements and measurements made with a 3D AFM.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2008.12.036