Contact degradation due to material transfer in MEM switches

The reliability of electrical contacts is now the major challenge to improve the lifetime of Micro Electro Mechanical Switches. This paper investigates contact failure due to material transfer in real MEMS devices. The mechanisms of degradation observed on components have been reproduced with a good...

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Bibliographic Details
Published in:Microelectronics and reliability 2012-09, Vol.52 (9-10), p.2261-2266
Main Authors: Peschot, A., Poulain, C., Souchon, F., Charvet, P.-L., Bonifaci, N., Lesaint, O.
Format: Article
Language:English
Subjects:
Applied sciences
Circuit properties
Electric power
Electric, optical and optoelectronic circuits
Electronic circuits
Electronics
Engineering Sciences
Exact sciences and technology
Interfaces
Micro- and nanoelectromechanical devices (mems/nems)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Switching, multiplexing, switched capacity circuits
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Summary:The reliability of electrical contacts is now the major challenge to improve the lifetime of Micro Electro Mechanical Switches. This paper investigates contact failure due to material transfer in real MEMS devices. The mechanisms of degradation observed on components have been reproduced with a good correlation on an AFM-based setup. Therefore, the importance of the closure phase and the voltage applied across the contact on the material transfer phenomenon has been highlighted with a fine quantitative analysis of the transferred volume.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2012.06.044