Wafer level packaging compatible with millimeter-wave antenna

This paper presents a technological process compatible process compatible with an above integrated circuit (IC) to achieve a millimeter wave antenna structure that is well-suited for wafer level packaging technology. The radiating patch is introduced inside of the air cavity of packaging. This struc...

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Bibliographic Details
Published in:Sensors and actuators. A. Physical. 2012, Vol.173 (1), p.238-243
Main Authors: Herth, E., Seok, S., Rolland, N., Lasri, T.
Format: Article
Language:English
Subjects:
Antennas
Compatibility
Coplanar waveguide fed aperture
Engineering Sciences
Gallium arsenide
Integrated circuits
MEMS
Millimeter-wave antenna
MMIC
Packaging
Patch antennas
Permittivity
Wafer level packaging
Wafers
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Summary:This paper presents a technological process compatible process compatible with an above integrated circuit (IC) to achieve a millimeter wave antenna structure that is well-suited for wafer level packaging technology. The radiating patch is introduced inside of the air cavity of packaging. This structure consists of two dielectric substrates and benzocyclobutene (BCB) sealing rings at the wafer level. The wafer level packaging that holds the radiating patch is made of Pyrex, a low permittivity substrate. The millimeter-wave antenna using the micromachining technology is excited by a coplanar waveguide fed aperture (CPWFA). This feeding mechanism is designed and realized on GaAs, a high permittivity substrate. The electromagnetic energy of the CPWFA to the radiating patch is made through a coupling slot. The fabricated antenna of 6 mm × 6 mm, including the ground plane, exhibits a 10 dB bandwidth of 3 GHz from 50.5 GHz to 53.5 GHz. The design has been driven by the interest of collective encapsulation of MEMS and MMICs devices.
ISSN:0924-4247
1873-3069
DOI:10.1016/j.sna.2011.09.040