Void growth in copper during high-temperature power-law creep

Growth of grain boundary voids during high-temperature power-law creep of metals is usually approximated as the growth of a hole in a nonlinearly viscous solid. Using synchrotron tomography, we show that the functional form of the continuum law is valid but that the real growth rates in copper are h...

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Bibliographic Details
Published in:Acta materialia 2011-01, Vol.59 (2), p.671-677
Main Authors: Dzieciol, K., Borbély, A., Sket, F., Isaac, A., Di Michiel, M., Cloetens, P., Buslaps, Th, Pyzalla, A.R.
Format: Article
Language:English
Subjects:
Applied sciences
Approximation
Copper
Creep
Creep (materials)
Creep test
Damage
Engineering Sciences
Exact sciences and technology
Glide
Grain boundaries
Materials
Mathematical models
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
Synchrotron tomography
Synchrotrons
Tomography
Void growth
Voids
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Summary:Growth of grain boundary voids during high-temperature power-law creep of metals is usually approximated as the growth of a hole in a nonlinearly viscous solid. Using synchrotron tomography, we show that the functional form of the continuum law is valid but that the real growth rates in copper are higher than the prediction of the viscous model by a factor of about 40. Submicrometer resolution tomography showing faceted void shapes as well as the large scatter of individual growth rates suggest that local dislocation glide has significative contribution to void growth.
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2010.10.003