Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications

Direct bonded copper (DBC) are produced by high temperature (>1000° C) bonding between copper and a ceramic (usually alumina). They are commonly used in power electronics. However, their reliability when exposed to thermal cycling is still an issue, that could be addressed by advanced numerical s...

Full description

Saved in:
Bibliographic Details
Published in:Microelectronics and reliability 2017-12, Vol.79, p.288-296
Main Authors: Kabaar, A. Ben, Buttay, C., Dezellus, O., Estevez, R., Gravouil, A., Gremillard, L.
Format: Article
Language:English
Subjects:
Ceramic substrates
Engineering Sciences
Mechanical characterization
Power electronics
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c394t-89e70f8df388a38b15a8da4b5da75271f27b2bddd76f00f838b172071dad3de73
cites cdi_FETCH-LOGICAL-c394t-89e70f8df388a38b15a8da4b5da75271f27b2bddd76f00f838b172071dad3de73
container_end_page 296
container_issue
container_start_page 288
container_title Microelectronics and reliability
container_volume 79
creator Kabaar, A. Ben
Buttay, C.
Dezellus, O.
Estevez, R.
Gravouil, A.
Gremillard, L.
description Direct bonded copper (DBC) are produced by high temperature (>1000° C) bonding between copper and a ceramic (usually alumina). They are commonly used in power electronics. However, their reliability when exposed to thermal cycling is still an issue, that could be addressed by advanced numerical simulations. This paper describes the identification of the parameters for a numerical model that uses finite elements with cohesive zones. This identification is based on careful mechanical characterization of all components of the DBC (ceramic, copper and interface) using an innovative approach based on image correlation. •Key components of a DBC Substrate are studied: copper, ceramic, and their interface.•For each of them, a model is identified from experiments.•Copper behaviour is strongly affected by annealing during assembly.•Interface bonding is identified from both local and global measurements.
doi_str_mv 10.1016/j.microrel.2017.06.001
format article
fullrecord <record><control><sourceid>elsevier_hal_p</sourceid><recordid>TN_cdi_hal_primary_oai_HAL_hal_01541230v1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0026271417301889</els_id><sourcerecordid>S0026271417301889</sourcerecordid><originalsourceid>FETCH-LOGICAL-c394t-89e70f8df388a38b15a8da4b5da75271f27b2bddd76f00f838b172071dad3de73</originalsourceid><addsrcrecordid>eNqFkE9LAzEQxYMoWKtfQXL1sOtk_2V7sxS1QsGLgreQTSY0ZbtZkrVSP71ZV716yuTx3hvmR8g1g5QBq2536d4q7zy2aQaMp1ClAOyEzFjNs2RRsLdTMgPIqiTjrDgnFyHsAIADYzNyXG2ll2pAbz_lYF1HnaF7Of5lG6jsNB22aD21XdSMVBjiSCXV1qMaaOM6jZoq1_foaXhvwuBjmhrnae8-ooZt9HnXWRXr-r616ntPuCRnJq7Aq593Tl4f7l9W62Tz_Pi0Wm4SlS-KIakXyMHU2uR1LfO6YaWstSyaUktexoNMxpus0VrzykA0jhaeAWda6lwjz-fkZurdylb03u6lPwonrVgvN2LUgJUFy3I4sOitJm_kGYJH8xdgIEbYYid-YYsRtoBKRNgxeDcFMV5ysOhFUBY7hRMmoZ39r-ILsOqO1g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications</title><source>ScienceDirect Journals</source><creator>Kabaar, A. Ben ; Buttay, C. ; Dezellus, O. ; Estevez, R. ; Gravouil, A. ; Gremillard, L.</creator><creatorcontrib>Kabaar, A. Ben ; Buttay, C. ; Dezellus, O. ; Estevez, R. ; Gravouil, A. ; Gremillard, L.</creatorcontrib><description>Direct bonded copper (DBC) are produced by high temperature (&gt;1000° C) bonding between copper and a ceramic (usually alumina). They are commonly used in power electronics. However, their reliability when exposed to thermal cycling is still an issue, that could be addressed by advanced numerical simulations. This paper describes the identification of the parameters for a numerical model that uses finite elements with cohesive zones. This identification is based on careful mechanical characterization of all components of the DBC (ceramic, copper and interface) using an innovative approach based on image correlation. •Key components of a DBC Substrate are studied: copper, ceramic, and their interface.•For each of them, a model is identified from experiments.•Copper behaviour is strongly affected by annealing during assembly.•Interface bonding is identified from both local and global measurements.</description><identifier>ISSN: 0026-2714</identifier><identifier>EISSN: 1872-941X</identifier><identifier>DOI: 10.1016/j.microrel.2017.06.001</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>Ceramic substrates ; Engineering Sciences ; Mechanical characterization ; Power electronics</subject><ispartof>Microelectronics and reliability, 2017-12, Vol.79, p.288-296</ispartof><rights>2017</rights><rights>Distributed under a Creative Commons Attribution 4.0 International License</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c394t-89e70f8df388a38b15a8da4b5da75271f27b2bddd76f00f838b172071dad3de73</citedby><cites>FETCH-LOGICAL-c394t-89e70f8df388a38b15a8da4b5da75271f27b2bddd76f00f838b172071dad3de73</cites><orcidid>0000-0001-7140-5804 ; 0000-0002-5967-8452 ; 0000-0001-7258-6483 ; 0000-0002-1570-4591</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>230,314,780,784,885,27924,27925</link.rule.ids><backlink>$$Uhttps://hal.science/hal-01541230$$DView record in HAL$$Hfree_for_read</backlink></links><search><creatorcontrib>Kabaar, A. Ben</creatorcontrib><creatorcontrib>Buttay, C.</creatorcontrib><creatorcontrib>Dezellus, O.</creatorcontrib><creatorcontrib>Estevez, R.</creatorcontrib><creatorcontrib>Gravouil, A.</creatorcontrib><creatorcontrib>Gremillard, L.</creatorcontrib><title>Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications</title><title>Microelectronics and reliability</title><description>Direct bonded copper (DBC) are produced by high temperature (&gt;1000° C) bonding between copper and a ceramic (usually alumina). They are commonly used in power electronics. However, their reliability when exposed to thermal cycling is still an issue, that could be addressed by advanced numerical simulations. This paper describes the identification of the parameters for a numerical model that uses finite elements with cohesive zones. This identification is based on careful mechanical characterization of all components of the DBC (ceramic, copper and interface) using an innovative approach based on image correlation. •Key components of a DBC Substrate are studied: copper, ceramic, and their interface.•For each of them, a model is identified from experiments.•Copper behaviour is strongly affected by annealing during assembly.•Interface bonding is identified from both local and global measurements.</description><subject>Ceramic substrates</subject><subject>Engineering Sciences</subject><subject>Mechanical characterization</subject><subject>Power electronics</subject><issn>0026-2714</issn><issn>1872-941X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNqFkE9LAzEQxYMoWKtfQXL1sOtk_2V7sxS1QsGLgreQTSY0ZbtZkrVSP71ZV716yuTx3hvmR8g1g5QBq2536d4q7zy2aQaMp1ClAOyEzFjNs2RRsLdTMgPIqiTjrDgnFyHsAIADYzNyXG2ll2pAbz_lYF1HnaF7Of5lG6jsNB22aD21XdSMVBjiSCXV1qMaaOM6jZoq1_foaXhvwuBjmhrnae8-ooZt9HnXWRXr-r616ntPuCRnJq7Aq593Tl4f7l9W62Tz_Pi0Wm4SlS-KIakXyMHU2uR1LfO6YaWstSyaUktexoNMxpus0VrzykA0jhaeAWda6lwjz-fkZurdylb03u6lPwonrVgvN2LUgJUFy3I4sOitJm_kGYJH8xdgIEbYYid-YYsRtoBKRNgxeDcFMV5ysOhFUBY7hRMmoZ39r-ILsOqO1g</recordid><startdate>20171201</startdate><enddate>20171201</enddate><creator>Kabaar, A. Ben</creator><creator>Buttay, C.</creator><creator>Dezellus, O.</creator><creator>Estevez, R.</creator><creator>Gravouil, A.</creator><creator>Gremillard, L.</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>AAYXX</scope><scope>CITATION</scope><scope>1XC</scope><scope>VOOES</scope><orcidid>https://orcid.org/0000-0001-7140-5804</orcidid><orcidid>https://orcid.org/0000-0002-5967-8452</orcidid><orcidid>https://orcid.org/0000-0001-7258-6483</orcidid><orcidid>https://orcid.org/0000-0002-1570-4591</orcidid></search><sort><creationdate>20171201</creationdate><title>Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications</title><author>Kabaar, A. Ben ; Buttay, C. ; Dezellus, O. ; Estevez, R. ; Gravouil, A. ; Gremillard, L.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c394t-89e70f8df388a38b15a8da4b5da75271f27b2bddd76f00f838b172071dad3de73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Ceramic substrates</topic><topic>Engineering Sciences</topic><topic>Mechanical characterization</topic><topic>Power electronics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kabaar, A. Ben</creatorcontrib><creatorcontrib>Buttay, C.</creatorcontrib><creatorcontrib>Dezellus, O.</creatorcontrib><creatorcontrib>Estevez, R.</creatorcontrib><creatorcontrib>Gravouil, A.</creatorcontrib><creatorcontrib>Gremillard, L.</creatorcontrib><collection>CrossRef</collection><collection>Hyper Article en Ligne (HAL)</collection><collection>Hyper Article en Ligne (HAL) (Open Access)</collection><jtitle>Microelectronics and reliability</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kabaar, A. Ben</au><au>Buttay, C.</au><au>Dezellus, O.</au><au>Estevez, R.</au><au>Gravouil, A.</au><au>Gremillard, L.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications</atitle><jtitle>Microelectronics and reliability</jtitle><date>2017-12-01</date><risdate>2017</risdate><volume>79</volume><spage>288</spage><epage>296</epage><pages>288-296</pages><issn>0026-2714</issn><eissn>1872-941X</eissn><abstract>Direct bonded copper (DBC) are produced by high temperature (&gt;1000° C) bonding between copper and a ceramic (usually alumina). They are commonly used in power electronics. However, their reliability when exposed to thermal cycling is still an issue, that could be addressed by advanced numerical simulations. This paper describes the identification of the parameters for a numerical model that uses finite elements with cohesive zones. This identification is based on careful mechanical characterization of all components of the DBC (ceramic, copper and interface) using an innovative approach based on image correlation. •Key components of a DBC Substrate are studied: copper, ceramic, and their interface.•For each of them, a model is identified from experiments.•Copper behaviour is strongly affected by annealing during assembly.•Interface bonding is identified from both local and global measurements.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/j.microrel.2017.06.001</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0001-7140-5804</orcidid><orcidid>https://orcid.org/0000-0002-5967-8452</orcidid><orcidid>https://orcid.org/0000-0001-7258-6483</orcidid><orcidid>https://orcid.org/0000-0002-1570-4591</orcidid><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 0026-2714
ispartof Microelectronics and reliability, 2017-12, Vol.79, p.288-296
issn 0026-2714
1872-941X
language eng
recordid cdi_hal_primary_oai_HAL_hal_01541230v1
source ScienceDirect Journals
subjects Ceramic substrates
Engineering Sciences
Mechanical characterization
Power electronics
title Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T05%3A07%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-elsevier_hal_p&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Characterization%20of%20materials%20and%20their%20interfaces%20in%20a%20direct%20bonded%20copper%20substrate%20for%20power%20electronics%20applications&rft.jtitle=Microelectronics%20and%20reliability&rft.au=Kabaar,%20A.%20Ben&rft.date=2017-12-01&rft.volume=79&rft.spage=288&rft.epage=296&rft.pages=288-296&rft.issn=0026-2714&rft.eissn=1872-941X&rft_id=info:doi/10.1016/j.microrel.2017.06.001&rft_dat=%3Celsevier_hal_p%3ES0026271417301889%3C/elsevier_hal_p%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c394t-89e70f8df388a38b15a8da4b5da75271f27b2bddd76f00f838b172071dad3de73%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true