Temperature and Dilatation Estimation for Modern Semiconductor Devices

This paper presents a new approach for measuring physical variables on micro-electronic components. An optical system is used to simultaneously quantify the surface temperature of a component and its expansion. This double acquisition is realized by a Michelson interferometer coupled with a Charge C...

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Bibliographic Details
Published in:Sensors & transducers 2015-01, Vol.184 (1), p.130-130
Main Authors: Joubert, Eric, Latry, Olivier, Roux, Jean-Philippe
Format: Article
Language:English
Subjects:
Charge coupled devices
Devices
Electronics
Engineering Sciences
Infrared cameras
Lasers
Methods
Michelson interferometers
Sensors
Surface temperature
Temperature
Three dimensional
Transducers
Vibration meters
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Summary:This paper presents a new approach for measuring physical variables on micro-electronic components. An optical system is used to simultaneously quantify the surface temperature of a component and its expansion. This double acquisition is realized by a Michelson interferometer coupled with a Charge Coupled Device (CCD) line device. To validate this method, the temperature measurements were directly compared with the results obtained by an infrared camera and by a measurement of variation of I (V). The displacement measurements were compared with those obtained by a laser 3D vibrometer, whose physical principle is completely different. Consistent results were obtained regarding the different techniques.
ISSN:2306-8515
1726-5479