High strength–high conductivity nanostructured copper wires prepared by spark plasma sintering and room-temperature severe plastic deformation

A pure copper cylinder with micrometric grains was prepared by spark plasma sintering and was wire-drawn at room temperature. The ultimate tensile strength of the conducting wires is 600MPa at room temperature. This originates from the propagation of dislocations by an Orowan mechanism in grains sma...

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Bibliographic Details
Published in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2016-01, Vol.649, p.209-213
Main Authors: Arnaud, Claire, Lecouturier, Florence, Mesguich, David, Ferreira, Nelson, Chevallier, Geoffroy, Estournès, Claude, Weibel, Alicia, Peigney, Alain, Laurent, Christophe
Format: Article
Language:English
Subjects:
Chemical Sciences
Conduction
Copper
COPPER (PURE)
Cylinders
DEFORMATION
ELECTRICAL CONDUCTIVITY
Electrical resistivity
Grains
Mechanical strength
Microstructure
MICROSTRUCTURES
Nanostructured materials
PLASMAS
Plastic deformation
PLASTIC STRAIN
Polymers
SINTERING
Spark plasma sintering
SPARK SINTERING
WIRE
Wire-drawing
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Summary:A pure copper cylinder with micrometric grains was prepared by spark plasma sintering and was wire-drawn at room temperature. The ultimate tensile strength of the conducting wires is 600MPa at room temperature. This originates from the propagation of dislocations by an Orowan mechanism in grains smaller than 250nm.
ISSN:0921-5093
1873-4936
DOI:10.1016/j.msea.2015.09.122