Investigation of the influence of the temperature on the fracture properties of adhesive joints using the Arcan device

• Published in: Engineering fracture mechanics 2022-06, Vol.269, p.108524, Article 108524
• Main Authors: Dumont, V., Stamoulis, G., Badulescu, C., Lefèvre, A., Thévenet, D.
• Format: Article
• Language: English
• Subjects: Adhesive joints; Arcan; Engineering Sciences; Fracture energy; Fracture mechanics; Glass transition temperature; Materials; Mechanics; Strain energy release rate; Structural bonding; Temperature effect
• ISSN: 0013-7944; 1873-7315
• DOI: 10.1016/j.engfracmech.2022.108524

The evolution of the mixed mode I＋II fracture envelope of a structural epoxy adhesive was investigated here, under three different temperatures: -15, 23 and 45 °C. The study was performed using the Arcan device, by improving a previously published methodology to calculate the critical strain energy release rate (GC). For the range of temperatures that was examined, the shape of the fracture envelopes remained similar. However, GC was found to decrease with the increase of the temperature. This was attributed to the energy intake of the adhesive material, since its glass transition temperature was measured at 88 °C (much higher than 45 °C). •Calculation of the fracture envelope of structural adhesives via TDCB-MMB tests and Arcan tests as a function of the temperature.•Establishment of an empirical working criteria to calculate the critical strain energy release rate directly from the force–displacement curves issued from Arcan tests.•The fracture envelope at room temperature calculated with the Arcan-based tests was almost identical to the one issued form TDCB-MMB tests at room temperature.•All fracture envelopes calculated at the temperature range from -15 °C to 45 °C were adequately described by the Gong–Benzeggagh failure criteria under the LEFM assumption.•The critical strain energy release rate was found to decrease quasi-linearly with the increase of temperature for all mode ratios that were examined.