Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering

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Bibliographic Details
Published in:Microelectronics and reliability 2021-11, Vol.126
Main Authors: Botter, N., Khazaka, R., Avenas, Y., Missiaen, J.M., Bouvard, D., Azzopardi, S.
Format: Article
Language:English
Subjects:
Chemical Sciences
Electronics
Engineering Sciences
Material chemistry
Online Access:Get full text
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ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2021.114206