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Characterization of Akilbenza clay from Cameroon and its performance for the removal of copper(II) ions from aqueous solution

Akilbenza clay (Akil) was characterized by XRD, FT-TIR, XRF, EDX, SEM, and N 2 gas adsorption. The adsorption performance for Cu(II) ions by this clay was also studied. Akil is composed mainly of kaolinite with mica illite and quartz as minor minerals. The ATR-FTIR analysis shows Si-O-Al, Si-O, Al-O...

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Bibliographic Details
Published in:Environmental science and pollution research international 2020-10, Vol.27 (29), p.36487-36497
Main Authors: Kentsa, Ernest, Abi, Charles Fon, Ngomo, Horace Manga, Ndi, Julius Nsami, Awad, Sary, Ketcha Mbadcam, Joseph
Format: Article
Language:English
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Summary:Akilbenza clay (Akil) was characterized by XRD, FT-TIR, XRF, EDX, SEM, and N 2 gas adsorption. The adsorption performance for Cu(II) ions by this clay was also studied. Akil is composed mainly of kaolinite with mica illite and quartz as minor minerals. The ATR-FTIR analysis shows Si-O-Al, Si-O, Al-O, Si-OH, and Al-OH as the main functional groups. SEM indicates that the clay particles are irregular in shape and size by supported BJH. Akil has a specific surface area of 45.62 m 2 /g with the presence of both mesopores and micropores. The average pore diameter is 19.4196 nm. XRF and EDX reveal that the clay is mainly composed of silica, aluminum, and iron with a Si/Al ratio of 1.41. For the adsorption performance of Cu(II) ions, a maximum quantity of 76 mg/g was recorded. Freundlich isotherm models best describe the adsorption processes at equilibrium. Kinetic studies revealed that the adsorption process was well explained with pseudo-second-order kinetic model. The value of the mean energy of adsorption from Temkin isotherm and the values from Elovich kinetic model suggest that the adsorption of Copper(II) ions on Akil is a combination between ion exchange and electrostatic attraction. The results obtained can be introduced into the database of knowledge on clay minerals with emphasis on their use for the removal of Cu(II) ions.
ISSN:0944-1344
1614-7499
DOI:10.1007/s11356-020-09502-9