New die bonding material with PSQ as a main agent having high heat dissipation

We have developed a new die bonding material by using our originally developed polysilsesquioxane(PSQ). By using this PSQ as the main agent and adding alumina filler, both high die shear strength and heat dissipation are achieved.

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Bibliographic Details
Main Authors: Furukawa, Yoshiki, Miyawaki, Manabu, Miura, Susumu, Shizuhata, Hironori, Saiki, Naoya
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Die bonding material
Heat dissipation
Heating systems
Integrated circuits
Junctions
Light emitting diodes
Microassembly
Polysilsesquioxane(PSQ)
Temperature
Online Access:Request full text
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Description
Summary:We have developed a new die bonding material by using our originally developed polysilsesquioxane(PSQ). By using this PSQ as the main agent and adding alumina filler, both high die shear strength and heat dissipation are achieved.
ISSN:2475-8418
DOI:10.1109/ICSJ55786.2022.10034704