A novel integrated passive substrate fabricated directly on an organic laminate for RF applications

We report here a novel integrated passive substrate using thin film technology directly fabricated on multi-layer laminates. The thin film part consists of electroplated Cu interconnect and low-loss BCB dielectric fabricated on flattened PPE laminated substrate. According to microstrip-based approac...

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Bibliographic Details
Main Authors: Okubora, A., Ogawa, T., Hirabayashi, T., Kosemura, T., Ogino, T., Nakayama, H., Oya, Y., Nishitani, Y., Asami, Y.
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Capacitors
Costs
Design. Technologies. Operation analysis. Testing
Dielectric substrates
Dielectric thin films
Dielectric, amorphous and glass solid devices
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Integrated circuits
Laminates
Magnetic devices
Packaging
Radio frequency
Resistors
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Semiconductor thin films
Thin film inductors
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Description
Summary:We report here a novel integrated passive substrate using thin film technology directly fabricated on multi-layer laminates. The thin film part consists of electroplated Cu interconnect and low-loss BCB dielectric fabricated on flattened PPE laminated substrate. According to microstrip-based approaches, inductor, capacitor and resistor structures were optimized and very high-Q inductors and capacitors were obtained. The separating routing design scheme between the thin film part and the multi-layer laminate part makes the RF-module compact and shows superior isolation performance.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2002.1008169