Removal of Macro Aluminum Defects on Wafer Backside

Advanced technology nodes require minimal defect density at every processing step. Wafer backside uniformity has become increasingly critical in modern high volume semiconductor manufacturing. Improvement in wafer backside cleans can benefit yield, defect reduction, and prevent expensive tool aborts...

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Main Authors: Patel, Akshit, Junquera, Trevor, Yu, Kun, Kuchibhatla, Sridhar, Sundaramoorthy, Nirmal, Sethupathi, Harith, Marble, Samuel, Biederman, Casey, Yatzor, Brett, O'Hara, Brian, Clements, Justin, Torcedo, Chris, Berardi, Marc, Sunkel, Elizabeth, Costello, Daniel, Reynolds, Tyler, Hatzistergos, Michael, Sih, Vincent, Morgenfield, Bradley, Famodu, Olugbenga
Format: Conference Proceeding
Language:English
Subjects:
Aluminum
Performance evaluation
Production
Semiconductor device manufacture
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creator Patel, Akshit
Junquera, Trevor
Yu, Kun
Kuchibhatla, Sridhar
Sundaramoorthy, Nirmal
Sethupathi, Harith
Marble, Samuel
Biederman, Casey
Yatzor, Brett
O'Hara, Brian
Clements, Justin
Torcedo, Chris
Berardi, Marc
Sunkel, Elizabeth
Costello, Daniel
Reynolds, Tyler
Hatzistergos, Michael
Sih, Vincent
Morgenfield, Bradley
Famodu, Olugbenga
description Advanced technology nodes require minimal defect density at every processing step. Wafer backside uniformity has become increasingly critical in modern high volume semiconductor manufacturing. Improvement in wafer backside cleans can benefit yield, defect reduction, and prevent expensive tool aborts. Backside defectivity not only poses a threat to high volume production but also increases scrap risk further downstream. In this paper, we present an effective backside wet cleans method in a single wafer clean toolset to remove Aluminum backside defects.
doi_str_mv 10.1109/ASMC57536.2023.10121068
format conference_proceeding
fullrecord <record><control><sourceid>ieee_CHZPO</sourceid><recordid>TN_cdi_ieee_primary_10121068</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>10121068</ieee_id><sourcerecordid>10121068</sourcerecordid><originalsourceid>FETCH-LOGICAL-i119t-e1e2590c855e6f8ad1fd7cc02ca3aee68364e742f05acbe6292762f5272e446c3</originalsourceid><addsrcrecordid>eNo1z89Kw0AQgPFVEGyrbyC4L5A4M5udzR5j_Asthap4LOtmFqJJI0kr-PYe1NN3-8Gn1CVCjgj-qnpa1dZZwzkBmRwBCYHLIzVHZltYNp6P1YyM44zZu1M1n6Z3AGBf4kyZjfTDV-j0kPQqxHHQVXfo292h1zeSJO4nPez0a0gy6usQP6a2kTN1kkI3yflfF-rl7va5fsiW6_vHulpmLaLfZ4JC1kMsrRVOZWgwNS5GoBhMEOHScCGuoAQ2xDdh8uSYkiVHUhQczUJd_LqtiGw_x7YP4_f2_9D8AA-IRMs</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Removal of Macro Aluminum Defects on Wafer Backside</title><source>IEEE Xplore All Conference Series</source><creator>Patel, Akshit ; Junquera, Trevor ; Yu, Kun ; Kuchibhatla, Sridhar ; Sundaramoorthy, Nirmal ; Sethupathi, Harith ; Marble, Samuel ; Biederman, Casey ; Yatzor, Brett ; O'Hara, Brian ; Clements, Justin ; Torcedo, Chris ; Berardi, Marc ; Sunkel, Elizabeth ; Costello, Daniel ; Reynolds, Tyler ; Hatzistergos, Michael ; Sih, Vincent ; Morgenfield, Bradley ; Famodu, Olugbenga</creator><creatorcontrib>Patel, Akshit ; Junquera, Trevor ; Yu, Kun ; Kuchibhatla, Sridhar ; Sundaramoorthy, Nirmal ; Sethupathi, Harith ; Marble, Samuel ; Biederman, Casey ; Yatzor, Brett ; O'Hara, Brian ; Clements, Justin ; Torcedo, Chris ; Berardi, Marc ; Sunkel, Elizabeth ; Costello, Daniel ; Reynolds, Tyler ; Hatzistergos, Michael ; Sih, Vincent ; Morgenfield, Bradley ; Famodu, Olugbenga</creatorcontrib><description>Advanced technology nodes require minimal defect density at every processing step. Wafer backside uniformity has become increasingly critical in modern high volume semiconductor manufacturing. Improvement in wafer backside cleans can benefit yield, defect reduction, and prevent expensive tool aborts. Backside defectivity not only poses a threat to high volume production but also increases scrap risk further downstream. In this paper, we present an effective backside wet cleans method in a single wafer clean toolset to remove Aluminum backside defects.</description><identifier>EISSN: 2376-6697</identifier><identifier>EISBN: 1665456396</identifier><identifier>EISBN: 9781665456395</identifier><identifier>DOI: 10.1109/ASMC57536.2023.10121068</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aluminum ; Performance evaluation ; Production ; Semiconductor device manufacture</subject><ispartof>2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2023, p.1-3</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/10121068$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,23930,23931,25140,27925,54555,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/10121068$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Patel, Akshit</creatorcontrib><creatorcontrib>Junquera, Trevor</creatorcontrib><creatorcontrib>Yu, Kun</creatorcontrib><creatorcontrib>Kuchibhatla, Sridhar</creatorcontrib><creatorcontrib>Sundaramoorthy, Nirmal</creatorcontrib><creatorcontrib>Sethupathi, Harith</creatorcontrib><creatorcontrib>Marble, Samuel</creatorcontrib><creatorcontrib>Biederman, Casey</creatorcontrib><creatorcontrib>Yatzor, Brett</creatorcontrib><creatorcontrib>O'Hara, Brian</creatorcontrib><creatorcontrib>Clements, Justin</creatorcontrib><creatorcontrib>Torcedo, Chris</creatorcontrib><creatorcontrib>Berardi, Marc</creatorcontrib><creatorcontrib>Sunkel, Elizabeth</creatorcontrib><creatorcontrib>Costello, Daniel</creatorcontrib><creatorcontrib>Reynolds, Tyler</creatorcontrib><creatorcontrib>Hatzistergos, Michael</creatorcontrib><creatorcontrib>Sih, Vincent</creatorcontrib><creatorcontrib>Morgenfield, Bradley</creatorcontrib><creatorcontrib>Famodu, Olugbenga</creatorcontrib><title>Removal of Macro Aluminum Defects on Wafer Backside</title><title>2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</title><addtitle>ASMC</addtitle><description>Advanced technology nodes require minimal defect density at every processing step. Wafer backside uniformity has become increasingly critical in modern high volume semiconductor manufacturing. Improvement in wafer backside cleans can benefit yield, defect reduction, and prevent expensive tool aborts. Backside defectivity not only poses a threat to high volume production but also increases scrap risk further downstream. In this paper, we present an effective backside wet cleans method in a single wafer clean toolset to remove Aluminum backside defects.</description><subject>Aluminum</subject><subject>Performance evaluation</subject><subject>Production</subject><subject>Semiconductor device manufacture</subject><issn>2376-6697</issn><isbn>1665456396</isbn><isbn>9781665456395</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2023</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNo1z89Kw0AQgPFVEGyrbyC4L5A4M5udzR5j_Asthap4LOtmFqJJI0kr-PYe1NN3-8Gn1CVCjgj-qnpa1dZZwzkBmRwBCYHLIzVHZltYNp6P1YyM44zZu1M1n6Z3AGBf4kyZjfTDV-j0kPQqxHHQVXfo292h1zeSJO4nPez0a0gy6usQP6a2kTN1kkI3yflfF-rl7va5fsiW6_vHulpmLaLfZ4JC1kMsrRVOZWgwNS5GoBhMEOHScCGuoAQ2xDdh8uSYkiVHUhQczUJd_LqtiGw_x7YP4_f2_9D8AA-IRMs</recordid><startdate>20230501</startdate><enddate>20230501</enddate><creator>Patel, Akshit</creator><creator>Junquera, Trevor</creator><creator>Yu, Kun</creator><creator>Kuchibhatla, Sridhar</creator><creator>Sundaramoorthy, Nirmal</creator><creator>Sethupathi, Harith</creator><creator>Marble, Samuel</creator><creator>Biederman, Casey</creator><creator>Yatzor, Brett</creator><creator>O'Hara, Brian</creator><creator>Clements, Justin</creator><creator>Torcedo, Chris</creator><creator>Berardi, Marc</creator><creator>Sunkel, Elizabeth</creator><creator>Costello, Daniel</creator><creator>Reynolds, Tyler</creator><creator>Hatzistergos, Michael</creator><creator>Sih, Vincent</creator><creator>Morgenfield, Bradley</creator><creator>Famodu, Olugbenga</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>20230501</creationdate><title>Removal of Macro Aluminum Defects on Wafer Backside</title><author>Patel, Akshit ; Junquera, Trevor ; Yu, Kun ; Kuchibhatla, Sridhar ; Sundaramoorthy, Nirmal ; Sethupathi, Harith ; Marble, Samuel ; Biederman, Casey ; Yatzor, Brett ; O'Hara, Brian ; Clements, Justin ; Torcedo, Chris ; Berardi, Marc ; Sunkel, Elizabeth ; Costello, Daniel ; Reynolds, Tyler ; Hatzistergos, Michael ; Sih, Vincent ; Morgenfield, Bradley ; Famodu, Olugbenga</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i119t-e1e2590c855e6f8ad1fd7cc02ca3aee68364e742f05acbe6292762f5272e446c3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Aluminum</topic><topic>Performance evaluation</topic><topic>Production</topic><topic>Semiconductor device manufacture</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Patel, Akshit</creatorcontrib><creatorcontrib>Junquera, Trevor</creatorcontrib><creatorcontrib>Yu, Kun</creatorcontrib><creatorcontrib>Kuchibhatla, Sridhar</creatorcontrib><creatorcontrib>Sundaramoorthy, Nirmal</creatorcontrib><creatorcontrib>Sethupathi, Harith</creatorcontrib><creatorcontrib>Marble, Samuel</creatorcontrib><creatorcontrib>Biederman, Casey</creatorcontrib><creatorcontrib>Yatzor, Brett</creatorcontrib><creatorcontrib>O'Hara, Brian</creatorcontrib><creatorcontrib>Clements, Justin</creatorcontrib><creatorcontrib>Torcedo, Chris</creatorcontrib><creatorcontrib>Berardi, Marc</creatorcontrib><creatorcontrib>Sunkel, Elizabeth</creatorcontrib><creatorcontrib>Costello, Daniel</creatorcontrib><creatorcontrib>Reynolds, Tyler</creatorcontrib><creatorcontrib>Hatzistergos, Michael</creatorcontrib><creatorcontrib>Sih, Vincent</creatorcontrib><creatorcontrib>Morgenfield, Bradley</creatorcontrib><creatorcontrib>Famodu, Olugbenga</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Patel, Akshit</au><au>Junquera, Trevor</au><au>Yu, Kun</au><au>Kuchibhatla, Sridhar</au><au>Sundaramoorthy, Nirmal</au><au>Sethupathi, Harith</au><au>Marble, Samuel</au><au>Biederman, Casey</au><au>Yatzor, Brett</au><au>O'Hara, Brian</au><au>Clements, Justin</au><au>Torcedo, Chris</au><au>Berardi, Marc</au><au>Sunkel, Elizabeth</au><au>Costello, Daniel</au><au>Reynolds, Tyler</au><au>Hatzistergos, Michael</au><au>Sih, Vincent</au><au>Morgenfield, Bradley</au><au>Famodu, Olugbenga</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Removal of Macro Aluminum Defects on Wafer Backside</atitle><btitle>2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</btitle><stitle>ASMC</stitle><date>2023-05-01</date><risdate>2023</risdate><spage>1</spage><epage>3</epage><pages>1-3</pages><eissn>2376-6697</eissn><eisbn>1665456396</eisbn><eisbn>9781665456395</eisbn><abstract>Advanced technology nodes require minimal defect density at every processing step. Wafer backside uniformity has become increasingly critical in modern high volume semiconductor manufacturing. Improvement in wafer backside cleans can benefit yield, defect reduction, and prevent expensive tool aborts. Backside defectivity not only poses a threat to high volume production but also increases scrap risk further downstream. In this paper, we present an effective backside wet cleans method in a single wafer clean toolset to remove Aluminum backside defects.</abstract><pub>IEEE</pub><doi>10.1109/ASMC57536.2023.10121068</doi><tpages>3</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier EISSN: 2376-6697
ispartof 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2023, p.1-3
issn 2376-6697
language eng
recordid cdi_ieee_primary_10121068
source IEEE Xplore All Conference Series
subjects Aluminum
Performance evaluation
Production
Semiconductor device manufacture
title Removal of Macro Aluminum Defects on Wafer Backside
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T02%3A56%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_CHZPO&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Removal%20of%20Macro%20Aluminum%20Defects%20on%20Wafer%20Backside&rft.btitle=2023%2034th%20Annual%20SEMI%20Advanced%20Semiconductor%20Manufacturing%20Conference%20(ASMC)&rft.au=Patel,%20Akshit&rft.date=2023-05-01&rft.spage=1&rft.epage=3&rft.pages=1-3&rft.eissn=2376-6697&rft_id=info:doi/10.1109/ASMC57536.2023.10121068&rft.eisbn=1665456396&rft.eisbn_list=9781665456395&rft_dat=%3Cieee_CHZPO%3E10121068%3C/ieee_CHZPO%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i119t-e1e2590c855e6f8ad1fd7cc02ca3aee68364e742f05acbe6292762f5272e446c3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=10121068&rfr_iscdi=true