5G mmWave Patch Antenna Array on Extremely Low Loss Alumina Ribbon Ceramic Substrates for Antenna-in-Packaging (AiP)

The multi-layer capability of Corning's alumina ribbon ceramic (ARC) substrates for 5G mmWave Antenna-in-Packaging (AiP) is demonstrated on the 1\times 4 array antenna using three 120\ \mu\mathrm{m} ARC substrates that have an extremely low dielectric loss, low profile, compactness, and good he...

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Bibliographic Details
Main Authors: Kim, Cheolbok, Kim, Hoon, Moon, Eun Ju, Peters, David R, Vanselous-Barrett, Heather, Seok, Seong-ho
Format: Conference Proceeding
Language:English
Subjects:
Alumina ribbon ceramic
Antenna
Antenna measurements
Antenna-in-Packaging
Bonding
Ceramics
Measurement by laser beam
Millimeter wave communication
mmWave
multi-layer
Temperature measurement
Transmission line measurements
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Summary:The multi-layer capability of Corning's alumina ribbon ceramic (ARC) substrates for 5G mmWave Antenna-in-Packaging (AiP) is demonstrated on the 1\times 4 array antenna using three 120\ \mu\mathrm{m} ARC substrates that have an extremely low dielectric loss, low profile, compactness, and good heat dissipation. The 1\times 4\ \text{mm} Wave array antenna is designed and fabricated by the laser ablation process, standard semi-additive metallization process, and Cu-Cu bonding with the Cu nitride passivation layer. The Cu nitride passivation layer allows lower process temperature and lower pressure than the conditions of direct Cu-Cu bonding. The fabricated 1\times 4 array antenna is characterized including a beam steering. It has a simulated and measured peak gain of 11.2 dBi and 10.8 dBi, respectively, with a simulated 3-dB beamwidth of 26.3° in the H-plane and 82.1° in the E-plane. The beam can be steered up to 50° with 150° input phase difference between antenna elements.
ISSN:2377-5726
DOI:10.1109/ECTC51909.2023.00088