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Effectiveness of c-Axis Aligned Crystalline IGZO FET as Selector Element and Ferroelectric Capacitor Scaling of 1T1C FeRAM

Aiming to reduce the area of a ferroelectric random access memory (FeRAM), we fabricated an FeRAM having a 1T1C configuration by using a c-axis aligned crystalline In-Ga-Zn-O field-effect transistor, which we call OSFET, with a high breakdown voltage. A combination of the OSFET with L/W of 60 nm/60...

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Bibliographic Details
Published in:IEEE journal of the Electron Devices Society 2023-01, Vol.11, p.1-1
Main Authors: Yazaki, Naomi, Motoyoshi, Ryosuke, Numata, Shiyuu, Ohshima, Kazuaki, Egi, Yuji, Isaka, Fumito, Ohno, Toshikazu, Tezuka, Sachiaki, Hamada, Toshiki, Furutani, Kazuma, Tsuda, Kazuki, Matsuzaki, Takanori, Onuki, Tatsuya, Murakawa, Tsutomu, Kunitake, Hitoshi, Kobayashi, Masaharu, Yamazaki, Shunpei
Format: Article
Language:English
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Summary:Aiming to reduce the area of a ferroelectric random access memory (FeRAM), we fabricated an FeRAM having a 1T1C configuration by using a c-axis aligned crystalline In-Ga-Zn-O field-effect transistor, which we call OSFET, with a high breakdown voltage. A combination of the OSFET with L/W of 60 nm/60 nm and a single damascene ferroelectric capacitor (FECap) attained FE-Cap area reduction to 0.06 μm2 per cell. The FeRAM achieved a write time of 10 ns, a rewriting endurance of 109 cycles, and a data retention time of 100 min at 85°C. The OSFET is an optimal selector element for emerging memories.
ISSN:2168-6734
2168-6734
DOI:10.1109/JEDS.2023.3307124