Enhanced technique through pattern and power modulation with ELITE system for failure analysis on advance package technology

In current revolution of silicon and package design, communication between silicon dice on a single package requires an advance package technology such as embedded multi-die interconnect bridge (EMIB) silicon to be integrated and introduced. In this paper, an enhanced and non-destructive technique t...

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Bibliographic Details
Main Authors: Ng, Wen Jye, Ooi, Yong Khai, Ng, Jou Ching, Oh, May Ling, Tong, Tom
Format: Conference Proceeding
Language:English
Subjects:
Cameras
ELITE
EMIB
Failure analysis
MCP
Micrometers
Modulation
Packaging
Silicon
Thermal analysis
Online Access:Request full text
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Summary:In current revolution of silicon and package design, communication between silicon dice on a single package requires an advance package technology such as embedded multi-die interconnect bridge (EMIB) silicon to be integrated and introduced. In this paper, an enhanced and non-destructive technique through pattern and power modulation with synchronization of Enhanced Lock-In thermal Emission (ELITE) camera was introduced to support failure analysis (FA) on this advance package technology. Case study with fault isolation results obtained from this technique on EMIB design will be shared in this paper. Different techniques used on ELITE system to support both single-die-package and multi-chip-package (MCP) product will also be presented to review the advantages and disadvantages of each technique.
ISSN:1946-1550
DOI:10.1109/IPFA58228.2023.10249039