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GaN-Based Threshold Switching Behaviors at High Temperatures Enabled by Interface Engineering for Harsh Environment Memory Applications
We demonstrate threshold switching behaviors with working temperatures up to 500 °C based on GaN vertical p-n diodes, and these devices survived a passive test in a simulated Venus environment (460 °C, 94 bar, CO2 gas flow) for ten days. This is realized via interface engineering through an etch-the...
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Published in: | IEEE transactions on electron devices 2024-03, Vol.71 (3), p.1641-1645 |
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Main Authors: | , , , , , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | We demonstrate threshold switching behaviors with working temperatures up to 500 °C based on GaN vertical p-n diodes, and these devices survived a passive test in a simulated Venus environment (460 °C, 94 bar, CO2 gas flow) for ten days. This is realized via interface engineering through an etch-then-regrow process combination with a Ga2O3 interlayer. It is hypothesized the traps in the interfacial layer can form/rupture a conductive path by trapping/detrapping electrons/holes, which are responsible for the observed threshold switching behaviors. To the best of our knowledge, this is the first demonstration of two-terminal threshold-switching memory devices under such high temperatures. These results can serve as a critical reference for the future development of GaN-based memory devices for harsh environment applications. |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/TED.2023.3321562 |