Loading…
Wafer-scale Al junction technology for superconducting quantum circuits
Josephson tunnel junctions represent a key element in superconducting electronics and quantum circuits. For many years, shadow evaporation by means of Dolan-type bridges has been the state-of-the-art for deep sub- micrometer sized structures. Increasing demand in the number of Josephson junctions, e...
Saved in:
Published in: | IEEE transactions on applied superconductivity 2024-05, Vol.34 (3), p.1-5 |
---|---|
Main Authors: | , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | Josephson tunnel junctions represent a key element in superconducting electronics and quantum circuits. For many years, shadow evaporation by means of Dolan-type bridges has been the state-of-the-art for deep sub- micrometer sized structures. Increasing demand in the number of Josephson junctions, e.g. in qubit circuits and travelling wave parametric amplifiers, requests for a wafer-scale fabrication process with precise control of junction parameters and have led to an advanced lift-off technique called Manhattan-type junction technology in recent years. Herein, we report on the development of a 100 mm wafer-scale fabrication technology for deep sub-micrometer sized Al Josephson junctions with linear dimensions down to 180 nm. The critical current I C of the junctions ranges from about 10 to 120 nA scaling with their linear dimensions. Low temperature transport measurements as well as room-temperature characterization has been used for I C and process homogeneity determination of series arrays of up to 50 Josephson junctions. We discuss technology parameters such as yield, on-chip and on-wafer reproducibility of the junction's critical currents as well as main process limitations. Moreover, we present experimental results on the characterization of first transmon-type qubits fabricated using this technology. |
---|---|
ISSN: | 1051-8223 1558-2515 |
DOI: | 10.1109/TASC.2024.3350580 |