A 3 Degrees-of-Freedom Electrothermal Micro-Positioner for Optical Chip-to-Chip Alignment

This article proposes an electrothermal three-degrees-of-freedom (3-DOF) micro-positioner equipped with a waveguide path, which can potentially be used for chip-to-chip alignment in photonic integrated circuits. The micro-positioner provides translational displacements along the x-, y- and z- axes w...

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Bibliographic Details
Published in:Journal of microelectromechanical systems 2024-04, Vol.33 (2), p.260-273
Main Authors: Rabih, Almur A. S., Nabavi, Seyedfakhreddin, Menard, Michael, Nabki, Frederic
Format: Article
Language:English
Subjects:
3 degrees of freedom (3-DOF)
3-axis micro-positioner
3-DOF
Actuators
Alignment
beam buckling
Degrees of freedom
electrothermal
Electrothermal actuators
Integrated circuits
optical alignment
Optical device fabrication
Optical waveguides
Photonic integrated circuits
Waveguides
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Summary:This article proposes an electrothermal three-degrees-of-freedom (3-DOF) micro-positioner equipped with a waveguide path, which can potentially be used for chip-to-chip alignment in photonic integrated circuits. The micro-positioner provides translational displacements along the x-, y- and z- axes with manageable levels of cross-sensitivity between axes. A fabricated prototype provides displacements of \pm 3.35~\mu \text{m} at 105 mW along the x-axis, and +4.5~\mu \text{m} at 140 mW along the y-axis. Moreover, +7~\mu \text{m} of out-of-plane displacement is achieved along the z-axis when 210 mW is applied to the x-axis actuators to buckle the structure. The AC response of the micro-positioner shows that the fundamental resonance mode occurs at 18.8 kHz. [2023-0208]
ISSN:1057-7157
1941-0158
DOI:10.1109/JMEMS.2024.3371829