A New Fabrication Method for Capacitive Displacement Sensor

Capacitive displacement sensor is becoming increasingly important in the industry due to its noncontact measurement, excellent dynamic performance, and high accuracy. However, traditional fabrication methods for high-precision capacitive displacement sensor suffer from low efficiency and high assemb...

Full description

Saved in:
Bibliographic Details
Published in:IEEE sensors journal 2024-05, Vol.24 (9), p.13856-13862
Main Authors: Zhang, Weilin, Bu, Zhenxiang, Li, Jiayin, Wu, Yuchen, Wang, Lingyun
Format: Article
Language:English
Subjects:
Assembly
Capacitive displacement/proximity sensor
Capacitive sensors
Composite structures
Displacement measurement
Edge effect
Electric fields
Electrodes
Fabrication
glass-in-silicon reflow process
Insulation
Kelvin guard ring
noncontact measurement
Parasitics (electronics)
Probes
Sensors
Silicon
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Capacitive displacement sensor is becoming increasingly important in the industry due to its noncontact measurement, excellent dynamic performance, and high accuracy. However, traditional fabrication methods for high-precision capacitive displacement sensor suffer from low efficiency and high assembly difficulties. In this article, a novel method to fabricate capacitive displacement sensor using a glass-in-silicon reflow process is proposed. This process combines semiconductor technology to realize an integrated fabrication of the conducting and insulating parts of the sensor probe. On the basis of the reduction of parasitic capacitance and the suppression of edge effect, this method can significantly reduce the fabrication difficulties and costs. In addition, it provides a new option for the fabrication of this type of composite structure, where the insulating parts are embedded coplanar with its conducting parts. The full text includes the simulation and design of the sensor, the research on the glass-in-silicon reflow process, the fabrication of the probe, and the assembly and measurement of the sensor. The experimental results fully verify the feasibility of the capacitive displacement sensor fabricated by the glass-in-silicon reflow process. The capacitive measurement curve shows the sensitivity of the sensor to the displacement, which indicates that the design of this sensor has potential for practical applications.
ISSN:1530-437X
1558-1748
DOI:10.1109/JSEN.2024.3375897