New High Resolution Method to Characterize CMP Slurry Particle Size Distributions

A new method has been created to more easily and accurately measure particle size distributions (PSD) in Chemical Mechanical Planarization (CMP) slurries from a few nanometers to one micrometer in size. It combines the use of a newly developed nanoparticle atomizer (NPA) and a Scanning Mobility Part...

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Bibliographic Details
Main Authors: Tiwari, Andrea J., Troolin, Daniel R., Patel, Atul H., Koczak, Justin S., Birkeland, Nathan T., Han, Hee-Siew
Format: Conference Proceeding
Language:English
Subjects:
aerosol metrology
Atmospheric measurements
Particle measurements
particle size distribution
Planarization
Process control
Semiconductor device manufacture
Semiconductor device measurement
Size measurement
SMPS
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Summary:A new method has been created to more easily and accurately measure particle size distributions (PSD) in Chemical Mechanical Planarization (CMP) slurries from a few nanometers to one micrometer in size. It combines the use of a newly developed nanoparticle atomizer (NPA) and a Scanning Mobility Particle Sizer (SMPS TM ), and requires only uncomplicated process steps of dilution and injection. This new method provides a straightforward means of assessing slurry characteristics even down to nanometer-sized particles, which are now being used in the semiconductor industry with increasing frequency. Such measurements enable improved qualification of outgoing or incoming slurries, the opportunity for better monitoring and control of CMP parameters (in process development, or in-line) to reduce defects and waste, as well as to monitor slurry aging.
ISSN:2376-6697
DOI:10.1109/ASMC61125.2024.10545439