Loading…

Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages

Hermetic Packages are of great importance for the recent miniaturization of quantum systems to secure a defined vacuum and gas species. In this work, a silicon membrane pressure sensor based on platinum strain gauge structures to measure the pressure dependent deflection of the membrane is shown. Th...

Full description

Saved in:

Bibliographic Details
Main Authors:	Koch, Jannik, Brinkmann, Levin Marten, Kassner, Alexander, Dencker, Folke, Wurz, Marc Christopher
Format:	Conference Proceeding
Language:	English
Subjects:	Bridges hermetic packages hermeticity monitoring Pressure measurement pressure sensor Pressure sensors Sensitivity Sensor phenomena and characterization Silicon Strain measurement
Online Access:	Request full text
Tags:	Add Tag No Tags, Be the first to tag this record!

cited_by
cites
container_end_page	200
container_issue
container_start_page	193
container_title
container_volume
creator	Koch, Jannik Brinkmann, Levin Marten Kassner, Alexander Dencker, Folke Wurz, Marc Christopher
description	Hermetic Packages are of great importance for the recent miniaturization of quantum systems to secure a defined vacuum and gas species. In this work, a silicon membrane pressure sensor based on platinum strain gauge structures to measure the pressure dependent deflection of the membrane is shown. The pressure sensors are used for inline monitoring of pressure and hermeticity of small-volume bonded packages. For this purpose, the sensors are fabricated by silicon microtechnology, characterized in a developed calibration setup and finally the pressure monitoring and hermeticity test of bonded packages were carried out.
doi_str_mv	10.1109/ECTC51529.2024.00040
format	conference_proceeding
fullrecord	<record><control><sourceid>ieee_CHZPO</sourceid><recordid>TN_cdi_ieee_primary_10565063</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>10565063</ieee_id><sourcerecordid>10565063</sourcerecordid><originalsourceid>FETCH-LOGICAL-i134t-afca40f6bc2f25f46e5986b76ce8d86744de00ade9bf5ba01f71be1ed4c270223</originalsourceid><addsrcrecordid>eNpFj8tOwzAURA0SEqX0D7rID6RcO34kSxSVh1SJBWVd-XFdDIlT2Smif08qkFiMZjFHMxpClhRWlEJzt263raCCNSsGjK8AgMMFWTSqqSsBlRJNLS7JjFVKlUIxeU1ucv44U0DrGfl-DV2wQyyNzuiKHnuTdMTikDDnY8IiY8xDKvykELswRf0QwzikEPfF4P9BHV3xjqnHMdgwns5Z7nXXlV9Dd-yxMEN008JB20-9x3xLrrzuMi7-fE7eHtbb9qncvDw-t_ebMtCKj6X2VnPw0ljmmfBc4nRIGiUt1q6WinOHANphY7wwGqhX1CBFxy1TwFg1J8vf3oCIu0MKvU6nHQUhBciq-gFmCGD5</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages</title><source>IEEE Xplore All Conference Series</source><creator>Koch, Jannik ; Brinkmann, Levin Marten ; Kassner, Alexander ; Dencker, Folke ; Wurz, Marc Christopher</creator><creatorcontrib>Koch, Jannik ; Brinkmann, Levin Marten ; Kassner, Alexander ; Dencker, Folke ; Wurz, Marc Christopher</creatorcontrib><description>Hermetic Packages are of great importance for the recent miniaturization of quantum systems to secure a defined vacuum and gas species. In this work, a silicon membrane pressure sensor based on platinum strain gauge structures to measure the pressure dependent deflection of the membrane is shown. The pressure sensors are used for inline monitoring of pressure and hermeticity of small-volume bonded packages. For this purpose, the sensors are fabricated by silicon microtechnology, characterized in a developed calibration setup and finally the pressure monitoring and hermeticity test of bonded packages were carried out.</description><identifier>EISSN: 2377-5726</identifier><identifier>EISBN: 9798350375985</identifier><identifier>DOI: 10.1109/ECTC51529.2024.00040</identifier><identifier>CODEN: IEEPAD</identifier><language>eng</language><publisher>IEEE</publisher><subject>Bridges ; hermetic packages ; hermeticity monitoring ; Pressure measurement ; pressure sensor ; Pressure sensors ; Sensitivity ; Sensor phenomena and characterization ; Silicon ; Strain measurement</subject><ispartof>2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.193-200</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/10565063$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,27924,54554,54931</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/10565063$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Koch, Jannik</creatorcontrib><creatorcontrib>Brinkmann, Levin Marten</creatorcontrib><creatorcontrib>Kassner, Alexander</creatorcontrib><creatorcontrib>Dencker, Folke</creatorcontrib><creatorcontrib>Wurz, Marc Christopher</creatorcontrib><title>Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages</title><title>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</title><addtitle>ECTC</addtitle><description>Hermetic Packages are of great importance for the recent miniaturization of quantum systems to secure a defined vacuum and gas species. In this work, a silicon membrane pressure sensor based on platinum strain gauge structures to measure the pressure dependent deflection of the membrane is shown. The pressure sensors are used for inline monitoring of pressure and hermeticity of small-volume bonded packages. For this purpose, the sensors are fabricated by silicon microtechnology, characterized in a developed calibration setup and finally the pressure monitoring and hermeticity test of bonded packages were carried out.</description><subject>Bridges</subject><subject>hermetic packages</subject><subject>hermeticity monitoring</subject><subject>Pressure measurement</subject><subject>pressure sensor</subject><subject>Pressure sensors</subject><subject>Sensitivity</subject><subject>Sensor phenomena and characterization</subject><subject>Silicon</subject><subject>Strain measurement</subject><issn>2377-5726</issn><isbn>9798350375985</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2024</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNpFj8tOwzAURA0SEqX0D7rID6RcO34kSxSVh1SJBWVd-XFdDIlT2Smif08qkFiMZjFHMxpClhRWlEJzt263raCCNSsGjK8AgMMFWTSqqSsBlRJNLS7JjFVKlUIxeU1ucv44U0DrGfl-DV2wQyyNzuiKHnuTdMTikDDnY8IiY8xDKvykELswRf0QwzikEPfF4P9BHV3xjqnHMdgwns5Z7nXXlV9Dd-yxMEN008JB20-9x3xLrrzuMi7-fE7eHtbb9qncvDw-t_ebMtCKj6X2VnPw0ljmmfBc4nRIGiUt1q6WinOHANphY7wwGqhX1CBFxy1TwFg1J8vf3oCIu0MKvU6nHQUhBciq-gFmCGD5</recordid><startdate>20240528</startdate><enddate>20240528</enddate><creator>Koch, Jannik</creator><creator>Brinkmann, Levin Marten</creator><creator>Kassner, Alexander</creator><creator>Dencker, Folke</creator><creator>Wurz, Marc Christopher</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>20240528</creationdate><title>Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages</title><author>Koch, Jannik ; Brinkmann, Levin Marten ; Kassner, Alexander ; Dencker, Folke ; Wurz, Marc Christopher</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i134t-afca40f6bc2f25f46e5986b76ce8d86744de00ade9bf5ba01f71be1ed4c270223</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Bridges</topic><topic>hermetic packages</topic><topic>hermeticity monitoring</topic><topic>Pressure measurement</topic><topic>pressure sensor</topic><topic>Pressure sensors</topic><topic>Sensitivity</topic><topic>Sensor phenomena and characterization</topic><topic>Silicon</topic><topic>Strain measurement</topic><toplevel>online_resources</toplevel><creatorcontrib>Koch, Jannik</creatorcontrib><creatorcontrib>Brinkmann, Levin Marten</creatorcontrib><creatorcontrib>Kassner, Alexander</creatorcontrib><creatorcontrib>Dencker, Folke</creatorcontrib><creatorcontrib>Wurz, Marc Christopher</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Koch, Jannik</au><au>Brinkmann, Levin Marten</au><au>Kassner, Alexander</au><au>Dencker, Folke</au><au>Wurz, Marc Christopher</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages</atitle><btitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</btitle><stitle>ECTC</stitle><date>2024-05-28</date><risdate>2024</risdate><spage>193</spage><epage>200</epage><pages>193-200</pages><eissn>2377-5726</eissn><eisbn>9798350375985</eisbn><coden>IEEPAD</coden><abstract>Hermetic Packages are of great importance for the recent miniaturization of quantum systems to secure a defined vacuum and gas species. In this work, a silicon membrane pressure sensor based on platinum strain gauge structures to measure the pressure dependent deflection of the membrane is shown. The pressure sensors are used for inline monitoring of pressure and hermeticity of small-volume bonded packages. For this purpose, the sensors are fabricated by silicon microtechnology, characterized in a developed calibration setup and finally the pressure monitoring and hermeticity test of bonded packages were carried out.</abstract><pub>IEEE</pub><doi>10.1109/ECTC51529.2024.00040</doi><tpages>8</tpages></addata></record>
fulltext	fulltext_linktorsrc
identifier	EISSN: 2377-5726
ispartof	2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.193-200
issn	2377-5726
language	eng
recordid	cdi_ieee_primary_10565063
source	IEEE Xplore All Conference Series
subjects	Bridges hermetic packages hermeticity monitoring Pressure measurement pressure sensor Pressure sensors Sensitivity Sensor phenomena and characterization Silicon Strain measurement
title	Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages
url	http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T09%3A03%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_CHZPO&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Silicon-based%20membrane%20pressure%20sensor%20for%20inline%20monitoring%20of%20pressure%20and%20hermeticity%20of%20small-volume%20bonded%20packages&rft.btitle=2024%20IEEE%2074th%20Electronic%20Components%20and%20Technology%20Conference%20(ECTC)&rft.au=Koch,%20Jannik&rft.date=2024-05-28&rft.spage=193&rft.epage=200&rft.pages=193-200&rft.eissn=2377-5726&rft.coden=IEEPAD&rft_id=info:doi/10.1109/ECTC51529.2024.00040&rft.eisbn=9798350375985&rft_dat=%3Cieee_CHZPO%3E10565063%3C/ieee_CHZPO%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i134t-afca40f6bc2f25f46e5986b76ce8d86744de00ade9bf5ba01f71be1ed4c270223%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=10565063&rfr_iscdi=true