Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints

• Main Authors: Horibe, Akihiro, Watanabe, Takahito, Marushima, Chinami, Kohara, Sayuri, Yamada, Yasuharu, Mori, Hiroyuki, Taneja, Divya, Pilger, Katherine, Jacques-Fortin, Alexis, Godard, Maxime, Chen, Qianwen, Perfecto, Eric, Jain, Aakrati, Ross, Joseph R, Wassick, Thomas, De Sousa, Isabel
• Format: Conference Proceeding
• Language: English
• Subjects: Bridges; chiplet; fine pitch solder joint; flip chip package; Laminates; Manufacturing; Semiconductor device reliability; Silicon; silicon bridge; Soldering; Thermomechanical processes
• ISSN: 2377-5726
• DOI: 10.1109/ECTC51529.2024.00051

Direct-bonded heterogeneous integration (DBHi) is a unique chiplet packaging technology using directly-bonded silicon bridges as high-density inter-chip connections. In this paper, we present the reliability results of the DBHi packages on standard laminate substrates without cavity or recess structures. The DBHi modules passed over 2000 cycles of thermal cycling test on JEDEC condition-G (-40~125°C). The selection of the encapsulant for micro joints with the right balance of flowability and joint protectability was the key for the excellent reliability performance. We also demonstrate the scalability to quad chip module (QCM) with silicon bridge chips comprising 30 µm-pitch solder joints. Furthermore, we confirmed the wafer probing test adaptability of the DBHi main chip wafer for mixed-pitch and mixed-height bumps/pads for known-good-dies (KGD) identification which is a key enabler for manufacturing of advanced packaging.