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Thermal Coupling of NTC Chip Thermistors
A novel device called thermal coupling of NTC chip thermistors was made by combining two electrically isolated chip thermistors Th 1 and Th 2 having small dimensions (0603) and small power (1/10 W). The first thermistor Th 1 (input thermistor) is self-heating at a constant supply voltage U - it gene...
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creator | Bodic, Milan Z. Aleksic, Stanko O. Rajs, Vladimir M. Damnjanovic, Mirjana S. Kisic, Milica G. |
description | A novel device called thermal coupling of NTC chip thermistors was made by combining two electrically isolated chip thermistors Th 1 and Th 2 having small dimensions (0603) and small power (1/10 W). The first thermistor Th 1 (input thermistor) is self-heating at a constant supply voltage U - it generates heat while the second thermistor Th 2 is passive (output thermistor) - it receives heat. Thermistors are electrically insulated, but thermally coupled. The temperature dependence of NTC chip thermistors R(T) was measured and exponential factor of thermistor resistance B was determined. After that, current I 1 of self-heating thermistor as a function of supply voltage U and using resistance R 1 of input thermistor was determined. The electrical resistance of output thermistor R 2 was measured by multimeter at the same time as the current of input thermistor. Using the Steinhart - Hart equation the temperature T 1 and T 2 of both thermistors were determined. The application of novel thermistor junction is expected in power microelectronics for electrical decoupling/thermal coupling of input to output slowly changeable signals. |
doi_str_mv | 10.1109/ISSE61612.2024.10604210 |
format | conference_proceeding |
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The first thermistor Th 1 (input thermistor) is self-heating at a constant supply voltage U - it generates heat while the second thermistor Th 2 is passive (output thermistor) - it receives heat. Thermistors are electrically insulated, but thermally coupled. The temperature dependence of NTC chip thermistors R(T) was measured and exponential factor of thermistor resistance B was determined. After that, current I 1 of self-heating thermistor as a function of supply voltage U and using resistance R 1 of input thermistor was determined. The electrical resistance of output thermistor R 2 was measured by multimeter at the same time as the current of input thermistor. Using the Steinhart - Hart equation the temperature T 1 and T 2 of both thermistors were determined. The application of novel thermistor junction is expected in power microelectronics for electrical decoupling/thermal coupling of input to output slowly changeable signals.</description><identifier>EISSN: 2161-2536</identifier><identifier>EISBN: 9798350385472</identifier><identifier>DOI: 10.1109/ISSE61612.2024.10604210</identifier><language>eng</language><publisher>IEEE</publisher><subject>Chip thermistors ; Cogeneration ; Couplings ; Current measurement ; heat transfer ; Resistance ; Semiconductor device measurement ; Temperature measurement ; thermal junction ; Thermistors</subject><ispartof>2024 47th International Spring Seminar on Electronics Technology (ISSE), 2024, Vol.2024, p.1-4</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/10604210$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,27904,54533,54910</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/10604210$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Bodic, Milan Z.</creatorcontrib><creatorcontrib>Aleksic, Stanko O.</creatorcontrib><creatorcontrib>Rajs, Vladimir M.</creatorcontrib><creatorcontrib>Damnjanovic, Mirjana S.</creatorcontrib><creatorcontrib>Kisic, Milica G.</creatorcontrib><title>Thermal Coupling of NTC Chip Thermistors</title><title>2024 47th International Spring Seminar on Electronics Technology (ISSE)</title><addtitle>ISSE</addtitle><description>A novel device called thermal coupling of NTC chip thermistors was made by combining two electrically isolated chip thermistors Th 1 and Th 2 having small dimensions (0603) and small power (1/10 W). The first thermistor Th 1 (input thermistor) is self-heating at a constant supply voltage U - it generates heat while the second thermistor Th 2 is passive (output thermistor) - it receives heat. Thermistors are electrically insulated, but thermally coupled. The temperature dependence of NTC chip thermistors R(T) was measured and exponential factor of thermistor resistance B was determined. After that, current I 1 of self-heating thermistor as a function of supply voltage U and using resistance R 1 of input thermistor was determined. The electrical resistance of output thermistor R 2 was measured by multimeter at the same time as the current of input thermistor. Using the Steinhart - Hart equation the temperature T 1 and T 2 of both thermistors were determined. The application of novel thermistor junction is expected in power microelectronics for electrical decoupling/thermal coupling of input to output slowly changeable signals.</description><subject>Chip thermistors</subject><subject>Cogeneration</subject><subject>Couplings</subject><subject>Current measurement</subject><subject>heat transfer</subject><subject>Resistance</subject><subject>Semiconductor device measurement</subject><subject>Temperature measurement</subject><subject>thermal junction</subject><subject>Thermistors</subject><issn>2161-2536</issn><isbn>9798350385472</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2024</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNo1jztPwzAYRQ0SEqXtP0DCI0vC57c9IquUShUdGubK8YMapSSKy8C_J-Ix3eFenaOL0B2BmhAwD5v9fiWJJLSmQHlNQAKnBC7Q0iijmQCmBVf0Es3otKqoYPIa3ZTyDiAYo2SG7ptjHE-uw7b_HLr88Yb7hF8ai-0xD_inzOXcj2WBrpLrSlz-5Ry9Pq0a-1xtd-uNfdxWebKfK260ciR5YQIY51uXXNLJCUZUmIQ8SAUpCeFbLVWESCF4ERU48MG3ibE5uv3l5hjjYRjzyY1fh_9n7Bte6UJJ</recordid><startdate>20240515</startdate><enddate>20240515</enddate><creator>Bodic, Milan Z.</creator><creator>Aleksic, Stanko O.</creator><creator>Rajs, Vladimir M.</creator><creator>Damnjanovic, Mirjana S.</creator><creator>Kisic, Milica G.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>20240515</creationdate><title>Thermal Coupling of NTC Chip Thermistors</title><author>Bodic, Milan Z. ; Aleksic, Stanko O. ; Rajs, Vladimir M. ; Damnjanovic, Mirjana S. ; Kisic, Milica G.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i106t-4987a1fc59d09acbafaf8fa5317d3214d670ff55cb867e0e20dc5e70a0cdcbf33</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Chip thermistors</topic><topic>Cogeneration</topic><topic>Couplings</topic><topic>Current measurement</topic><topic>heat transfer</topic><topic>Resistance</topic><topic>Semiconductor device measurement</topic><topic>Temperature measurement</topic><topic>thermal junction</topic><topic>Thermistors</topic><toplevel>online_resources</toplevel><creatorcontrib>Bodic, Milan Z.</creatorcontrib><creatorcontrib>Aleksic, Stanko O.</creatorcontrib><creatorcontrib>Rajs, Vladimir M.</creatorcontrib><creatorcontrib>Damnjanovic, Mirjana S.</creatorcontrib><creatorcontrib>Kisic, Milica G.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bodic, Milan Z.</au><au>Aleksic, Stanko O.</au><au>Rajs, Vladimir M.</au><au>Damnjanovic, Mirjana S.</au><au>Kisic, Milica G.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Thermal Coupling of NTC Chip Thermistors</atitle><btitle>2024 47th International Spring Seminar on Electronics Technology (ISSE)</btitle><stitle>ISSE</stitle><date>2024-05-15</date><risdate>2024</risdate><volume>2024</volume><spage>1</spage><epage>4</epage><pages>1-4</pages><eissn>2161-2536</eissn><eisbn>9798350385472</eisbn><abstract>A novel device called thermal coupling of NTC chip thermistors was made by combining two electrically isolated chip thermistors Th 1 and Th 2 having small dimensions (0603) and small power (1/10 W). The first thermistor Th 1 (input thermistor) is self-heating at a constant supply voltage U - it generates heat while the second thermistor Th 2 is passive (output thermistor) - it receives heat. Thermistors are electrically insulated, but thermally coupled. The temperature dependence of NTC chip thermistors R(T) was measured and exponential factor of thermistor resistance B was determined. After that, current I 1 of self-heating thermistor as a function of supply voltage U and using resistance R 1 of input thermistor was determined. The electrical resistance of output thermistor R 2 was measured by multimeter at the same time as the current of input thermistor. Using the Steinhart - Hart equation the temperature T 1 and T 2 of both thermistors were determined. The application of novel thermistor junction is expected in power microelectronics for electrical decoupling/thermal coupling of input to output slowly changeable signals.</abstract><pub>IEEE</pub><doi>10.1109/ISSE61612.2024.10604210</doi><tpages>4</tpages></addata></record> |
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identifier | EISSN: 2161-2536 |
ispartof | 2024 47th International Spring Seminar on Electronics Technology (ISSE), 2024, Vol.2024, p.1-4 |
issn | 2161-2536 |
language | eng |
recordid | cdi_ieee_primary_10604210 |
source | IEEE Xplore All Conference Series |
subjects | Chip thermistors Cogeneration Couplings Current measurement heat transfer Resistance Semiconductor device measurement Temperature measurement thermal junction Thermistors |
title | Thermal Coupling of NTC Chip Thermistors |
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