EM-Thermal Correlation Technologies for Industrial-Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules

• Main Authors: Wane, S., Dinh, T.V., Alkhalifeh, K., Bajon, D., Kendig, D., Shakouri, M., Gray, D., Shakouri, A., Bolomey, J.-Ch, Cabrera, A. E., de Ledinghen, E., Laban, P.
• Format: Conference Proceeding
• Language: English
• Subjects: Antenna measurements; beamforming; failure analysis; front-end-modules(FEM); heterogeneous 3D packaging; Microwave measurement; OTA industrial-testing; Productivity; Silicon-on-insulator; stochastic field-field correlation functions; Synchronization; Thermoreflectance imaging; Three-dimensional displays; Time-domain thermo-reflectance imaging
• ISSN: 2995-4428
• DOI: 10.1109/WMCS62019.2024.10619034

A hybrid RF-optics electromagnetic-thermal-imaging correlation-technology for over-the-air industrial-testing of 3D heterogeneous chip-package-PCB-antenna modules in a unified sub-10GHz and mmW platform is presented. Fast multi-channel RF-correlators are combined with advanced transient multi-beam thermal-imaging achieving time-resolutions from millisecond(ms) to microsecond( \mu \mathrm{s} ) scales in synchronized pulsed modes enabling ultra-fast testing solutions suitable for industry mass-production requirements. Thermoreflectance imaging technologies can meet the challenges imposed by advanced chip-package-PCB-antenna modules by providing sub-micron spatial resolution(beyond diffraction limit) and temporal resolution in the picosecond range. The proposed testing technology is validated through several practical applications using front-end-modules(FEMs) manufactured in advanced heterogeneous GaN and FDSOI technologies co-integrated with antenna-in-package(AiP) modules in various packages including WLCSP fan-in/fan-out, system-in-package(SiP), package-on-package(PoP), and multi-chip-modules(MCM). The proposed test solutions bridge modeling and measurement into a common framework, offering benefits that include productivity enhancement and facilitation of Digital-Twin requirements.