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Design and Implementation of Junction Temperature Estimation of Double-Sided Cooling Power Modules for Electric Vehicles Based on Watercourse Temperature Measurement
In this paper, a method based on watercourse temperature is proposed to estimate the power semiconductor junction temperature, with the consideration of the thermal coupling effect among chips. Unlike conventional approaches, the NTC sampling temperature is not directly utilized to represent the jun...
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Main Authors: | , , |
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Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
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Summary: | In this paper, a method based on watercourse temperature is proposed to estimate the power semiconductor junction temperature, with the consideration of the thermal coupling effect among chips. Unlike conventional approaches, the NTC sampling temperature is not directly utilized to represent the junction temperature. Instead, this method addresses the uncertainty of the thermal impedance model, and calculates the junction temperature using the Kalman filtering method. This method comprehensively considers the actual thermal model of the module, minimizes memory usage, and accurately estimates the junction temperature of the double-sided water-cooled module based on watercourse temperature measurements. Simulation results demonstrate that the method achieves a junction temperature estimation error within 1 °C under steady-state working conditions. |
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ISSN: | 2836-9734 |
DOI: | 10.1109/ICEPT63120.2024.10668672 |