An Efficient Linear Programming Model for Dual-arm Cluster Tools with Chamber Cleaning Operation

In semiconductor manufacturing, a cluster tool consists of loadlocks, several processing chambers and a robot for transporting wafers. During wafer fabrication, a chamber needs cleaning for removing residual gases and solid particles to reduce risk of contamination wafer surface. Chamber cleaning ma...

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Bibliographic Details
Main Authors: Wu, GuanZhong, Pan, ChunRong, Xiong, WenQing, He, Lifa
Format: Conference Proceeding
Language:English
Subjects:
chamber cleaning
Cleaning
cluster tools
Gases
Job shop scheduling
Linear programming
Process control
Robot sensing systems
scheduling optimization
Semiconductor device manufacture
Semiconductor device modeling
semiconductor manufacturing
System recovery
Throughput
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Description
Summary:In semiconductor manufacturing, a cluster tool consists of loadlocks, several processing chambers and a robot for transporting wafers. During wafer fabrication, a chamber needs cleaning for removing residual gases and solid particles to reduce risk of contamination wafer surface. Chamber cleaning makes the scheduling problem of cluster tools more complicated, which leads to deadlock. The method based on virtual wafer can avoid such problem, but this method also reduces chamber utilization. Aiming to improve the throughput of cluster tools with chamber cleaning, this paper modifies robot sequences and adjusts the processing time of virtual wafer. Then, based on the time characteristics of the system, a linear programming model is established to achieve the optimal solution of scheduling. Finally, illustrative examples are given to verify the feasibility and effectiveness of the proposed method. Compared with the existing virtual wafer method, this method can effectively reduce the system cycle time and improve the production efficiency of dual-arm cluster tools with chamber cleaning.
ISSN:2766-8665
DOI:10.1109/ICNSC62968.2024.10760243