Understanding Sn Whisker Growth Mechanisms and Influencing Factors

Tin whiskers are microscopic filamentary structures that grow spontaneously from tin and tin-alloy surfaces. They pose significant reliability risks in electronic devices due to their potential to cause short circuits. In recent years, significant research has sought to develop an understanding of t...

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Bibliographic Details
Main Authors: Flowers, George T., Bozack, Michael J., Crandall, Erika, Snipes, Erica, Rodekohr, Chad, Gainey, Elizabeth
Format: Conference Proceeding
Language:English
Subjects:
Electronic components
Integrated circuit reliability
Material properties
Performance evaluation
Prevention and mitigation
Reliability engineering
Reviews
Stress
Tin
Online Access:Request full text
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Summary:Tin whiskers are microscopic filamentary structures that grow spontaneously from tin and tin-alloy surfaces. They pose significant reliability risks in electronic devices due to their potential to cause short circuits. In recent years, significant research has sought to develop an understanding of the underlying mechanisms governing tin whisker formation and to devise effective mitigation strategies. This review synthesizes key findings from a series of basic studies, each seeking to provide unique insights into the complex nature of tin whisker growth.
ISSN:2158-9992
DOI:10.1109/HOLM56222.2024.10768387