Multi-Physics Field Coupling Simulation of \text Gasfilled GIS Disconnecting Switch Contact Temperature

• Main Authors: Wei, Dengfeng, Lin, Yihong, Zhang, Zhiwen, Chen, Ye
• Format: Conference Proceeding
• Language: English
• Subjects: Conductors; Couplings; GIS disconnecting switch; Heating systems; Mathematical models; multiphysics field simulation; Power systems; Skin effect; Switches; Temperature distribution
• ISSN: 2643-9816
• DOI: 10.1109/ICEPE-ST61894.2024.10792510

Thermal failure is one of the main causes of GIS failure, the internal contact temperature is a direct temperature rise indicator for the thermal failure of GIS disconnecting switches, and multi-physics field coupled simulation is one of the important means to study the internal temperature rise of GIS disconnecting switches to heat up, so it is of great significance to study the contact temperature of GIS disconnecting switches through multi-physics field simulation. In this paper, firstly, the mathematical models of electromagnetic field and temperaturefluid field are constructed, and then, taking the 110 kV GIS disconnecting switch as the research object, the physical modeling is carried out after the simplification of the actual model, and the electric-thermal-fluid three-field coupling simulation model is established by using the two circles to equate the contact resistance of the GIS disconnecting switch. Based on the consideration of skin effect and neighborhood effect and electromagnetic simulation, the loss distribution of GIS disconnecting switch is calculated. The calculated loss is coupled to the temperature fluid field as a heat source to obtain the temperature field distribution of the GIS disconnecting switch contacts. The results show that: the highest point temperature at the conductor is 69.06{ }^{\circ} \mathrm{C} , located in the top of the uppermost conductor contacts, the internal air is heated upward to form the phenomenon of three-phase conductor temperature increases sequentially, but the trend of increase is small.