Signal, Power and Thermal Co-Simulation Approach to Validate Interconnects on IC Package and System Board

The Signal and power integrity analysis of system electrical interconnects, including the effects of system thermal conditions is presented here. A case study of LPDDR4 section interconnect on an IC package substrate and on a system board is considered for this analysis. Multiple iterations of simul...

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Bibliographic Details
Main Authors: Jagadeesh, Rajesh Badala, Ramashastry, Venkatesh, Ramprasad, Bharath, Rao Bengaluru Srihari, Surya Prakash, Bhat, Satvik
Format: Conference Proceeding
Language:English
Subjects:
co-simulation
IC Package
Integrated circuit modeling
Joule heating
Noise
Parasitics
Power Aware (PA)
Power Distribution Network (PDN)
Power Integrity (PI)
Power supplies
Resistance heating
Signal integrity
Signal Integrity (SI)
Simultaneous Switching Output (SSO)
Substrates
Switches
Switching circuits
Thermal analysis
Thermal noise
Thermal simulation
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Description
Summary:The Signal and power integrity analysis of system electrical interconnects, including the effects of system thermal conditions is presented here. A case study of LPDDR4 section interconnect on an IC package substrate and on a system board is considered for this analysis. Multiple iterations of simulations are carried out to observe the inter-relation between signal and power interconnect and the effect of thermal on the electrical performance.
ISSN:2833-8413
DOI:10.1109/ICAICA63239.2024.10823038