Foreword

Saved in:
Bibliographic Details
Published in:IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1980-06, Vol.3 (2), p.209-210
Main Authors: Willardson, R., Coda, N., Domingos, H.
Format: Article
Language:English
Subjects:
Capacitors
Conducting materials
Design engineering
Electronics industry
Electronics packaging
Gold
Hybrid integrated circuits
Integrated circuit packaging
Resistors
Vehicles
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:0148-6411
DOI:10.1109/TCHMT.1980.1135608