Reliability of manufacturing 6 inch InGaP HBTs

Reliability tests for production level 6 inch InGaP HBTs have been investigated. 6 inch InGaP HBTs have been fabricated and qualified in terms of etching and DC/RF performance uniformity before the reliability test issues. A three temperature accelerated test has been performed to predict MTTF at a...

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Bibliographic Details
Main Authors: Sanghoon Cheon, Sung-Su Kim, Dae-Hyon Kim, Jae-Woo Park
Format: Conference Proceeding
Language:English
Subjects:
Etching
Humidity
Life estimation
Manufacturing
Performance evaluation
Production
Radio frequency
Stress
Temperature
Testing
Online Access:Request full text
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Summary:Reliability tests for production level 6 inch InGaP HBTs have been investigated. 6 inch InGaP HBTs have been fabricated and qualified in terms of etching and DC/RF performance uniformity before the reliability test issues. A three temperature accelerated test has been performed to predict MTTF at a certain temperature using the Arrhenius expression. The extrapolated MTTF at a junction temperature 125/spl deg/C is 1.5/spl times/10/sup 8/ hours with an activation energy of 1.98 eV. Furthermore, humidity stress tests were also carried out.
DOI:10.1109/GAAS.2002.1167933