An overview of thermal management for next generation microelectronic devices

The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the...

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Bibliographic Details
Main Authors: Tonapi, S.S., Fillion, R.A., Schattenmann, F.J., Cole, H.S., Evans, J.D., Sammakia, B.G.
Format: Conference Proceeding
Language:English
Subjects:
Aerospace materials
Costs
Electronic packaging thermal management
Electronics cooling
Electronics packaging
Microelectronics
Power dissipation
Power system management
Thermal management
Thermal management of electronics
Online Access:Request full text
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Description
Summary:The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.
ISSN:1078-8743
2376-6697
DOI:10.1109/ASMC.2003.1194502