Factory automation migration experience for foundry fab from 200 mm to 300 mm

As the semiconductor industry increases interest in 300 mm wafer size transition, Taiwan Semiconductor Manufacturing Company (TSMC) also dedicated to participate in the 300 mm development and mass production. The goal in TSMC is to achieve or exceed the current 200 mm foundry service, which offers l...

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Bibliographic Details
Main Authors: Lin, L.R., Chu, H.L., Hung, C.H., Lee, Y.C., Yeh, P.C.
Format: Conference Proceeding
Language:English
Subjects:
Computer integrated manufacturing
Delay
Dispatching
Foundries
Manufacturing automation
Materials handling
Production systems
Real time systems
Semiconductor device manufacture
Software tools
Online Access:Request full text
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Summary:As the semiconductor industry increases interest in 300 mm wafer size transition, Taiwan Semiconductor Manufacturing Company (TSMC) also dedicated to participate in the 300 mm development and mass production. The goal in TSMC is to achieve or exceed the current 200 mm foundry service, which offers leading edge technology, good on-time delivery, and excellent product quality for 300 mm Fabs. To reduce the risk of 300 mm function uncertainly and shorten the development effort for new technology, two-phase development approach had been taken to set-up 300 mm fab. environment. For the detailed TSMC 300 mm fab plan, manufacturing strategy and technology transition will be discussed in this paper.
DOI:10.1109/SMTW.2002.1197447