Electrical modeling and characterization of packaging solutions utilizing lead-free second level interconnects

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Bibliographic Details
Main Authors: O'Connor, D.P., Hamel, H., Spring, C., Audet, J.
Format: Conference Proceeding
Language:English
Subjects:
Ceramics
Environmentally friendly manufacturing techniques
Geometry
Hardware
Leg
Packaging
Power distribution
Power system interconnection
Springs
Voltage
Online Access:Request full text
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ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2003.1216456