Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

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Bibliographic Details
Main Authors: Guo-Wei Xiao, Jing-Feng Gong, Yau, E.W.C., Chan, P.C.H., Lee, R.S.W., Yuen, M.M.F.
Format: Conference Proceeding
Language:English
Subjects:
Artificial intelligence
Copper
Fabrication
Gold
Mechanical engineering
Printing
Resists
Scanning electron microscopy
Sputtering
Throughput
Online Access:Request full text
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ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2003.1216556